5CSEBA4U19C8N vs 5CSEBA4U19A7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U19C8N sa pamamagitan ng Intel at 5CSEBA4U19A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CSEBA4U19C8N 5CSEBA4U19A7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 40K 40 K
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 600 MHz —
FPGA Fabric Speed Grade -8 —
Packhaging 484-UBGA (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Temperature na Operasyon 0C to +85C (commercial) —
Process Technology TSMC 28nm low-power —
User I/O Count 161 —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Level ng MSL 3 (168 hours) 3 (168 hours)
Supply Voltage (Core) [DATA_NEEDED: VCC core voltage] —
DSP Blocks [DATA_NEEDED: number of DSP blocks] —
Embedded Memory (M10K) [DATA_NEEDED: M10K block count] —
Transceivers None (SE variant - no high-speed transceivers) —
Configuration Method Serial (EPCS) and Parallel —
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Temperature ng Junction na Operasyon — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)

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