5CSEBA5U19A7N vs 5CSEBA4U19A7N 比較

詳細並排比較 5CSEBA5U19A7N 由 Intel 與 5CSEBA4U19A7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CSEBA5U19A7N 5CSEBA4U19A7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 40 K
Process Technology 28 nm low-power —
Hard Processor System (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 700 MHz —
封裝 484-pin UBG A (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage (Core) 1.1 V —
Operating Temperature Grade Automotive (AEC-Q100) -40C to +125C —
I/O Count 66 (per source listing) —
Memory Interface DDR3 controller in HPS; external memory interface in FPGA fabric —
DSP Blocks Variable-precision DSP blocks —
Configuration / Boot Modes NAND, QSPI, SD/MMC —
RoHS 狀態 Compliant (per Ampheo listing) Compliant
Automotive Qualification AEC-Q100 (Automotive grade, indicated by 'A' in part number) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
工作接面溫度 — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)
MSL 等級 — 3 (168 hours)

資料表與資源

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