5CSEBA5U19A7N vs 5CSEBA4U19A7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA5U19A7N sa pamamagitan ng Intel at 5CSEBA4U19A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CSEBA5U19A7N 5CSEBA4U19A7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Logic Elements 85,000 40 K
Process Technology 28 nm low-power —
Hard Processor System (HPS) Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Frequency 700 MHz —
Packhaging 484-pin UBG A (19x19 mm) 484-UBGA (U19), 19x19 mm, 1.0 mm pitch
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage (Core) 1.1 V —
Operating Temperature Grade Automotive (AEC-Q100) -40C to +125C —
I/O Count 66 (per source listing) —
Memory Interface DDR3 controller in HPS; external memory interface in FPGA fabric —
DSP Blocks Variable-precision DSP blocks —
Configuration / Boot Modes NAND, QSPI, SD/MMC —
Tindminan RoHS Compliant (per Ampheo listing) Compliant
Automotive Qualification AEC-Q100 (Automotive grade, indicated by 'A' in part number) —
Hard Processor System — Dual ARM Cortex-A9 MPCore with CoreSight
Adaptive Logic Modules — [DATA_NEEDED: ALM count]
Embedded Memory — 3.4 Mbits (M9K)
DSP Blocks (18x18 Multipliers) — 224
PLLs — [DATA_NEEDED: PLL count]
HPS Maximum Application Clock — 925 MHz
Memory Interfaces — DDR3, DDR3L, LPDDR2 (via HPS); soft DDR3/2 in FPGA
User I/O — 161
Temperature ng Junction na Operasyon — -40C to +125C (automotive) / -40C to +100C (industrial)
Process Node — TSMC 28 nm low-power
Core Voltage — 1.1 V (typical)
Level ng MSL — 3 (168 hours)

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