A3P250-2FGG144 vs A3P600-2FGG144 比較

詳細並排比較 A3P250-2FGG144 由 Microchip Technology 與 A3P600-2FGG144 由 Microsemi. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
A3P250-2FGG144 A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip

A3P250-2FGG144 - ProASIC3 Flash FPGA 250K Gates | Microchip

A3P250-2FGG144 ✓ 啟用中
Microsemi
A3P600-2FGG144 A3P600-2FGG144 - 600K Gate Flash FPGA 144-FBGA | Microchip

A3P600-2FGG144 - 600K Gate Flash FPGA 144-FBGA | Microchip

A3P600-2FGG144 ✓ 啟用中

規格比較

參數 A3P250-2FGG144 A3P600-2FGG144
品牌 Microchip Technology Microsemi
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family ProASIC3 Flash FPGA ProASIC3
System Gates 250K —
User I/Os 97 —
Configuration Memory 36864 (on-chip flash) —
Speed Grade -2 -2
Maximum System Performance 310 MHz —
Process Technology 130 nm 130 nm CMOS
Core Supply Voltage 1.5 V —
封裝 144-LBGA (FBGA-144) 144-Ball FBGA (FGG144)
安裝方式 SMD/SMT —
Operating Temperature (Min) 0 C —
Operating Temperature (Max) +70 C —
Packaging Tray Tray
Soft ARM Support Yes (optional, ProASIC3 family) —
Configuration Type Flash (single-chip, live at power-up) —
Reprogrammability Yes (in-system reprogrammable) —
Equivalent Gate Count — 600000 gates
Logic Cells (CLBs) — 13824 CLBs
User I/O — 97 I/O
System Performance — 310 MHz
Core Voltage — 1.5 V
Program Technology — Nonvolatile Flash
Ball Pitch — 1 mm
安裝類型 — Surface Mount
Configuration — Single-chip, Instant On, no external boot device
I/O Banks — 4 (independently supplied VCCIB banks)
Embedded Memory — [DATA_NEEDED: embedded RAM bits]
工作溫度 — [DATA_NEEDED: operating temperature range]
RoHS 狀態 — [DATA_NEEDED: RoHS status]

資料表與資源

瀏覽所有產品 建立 BOM 索取報價