A3PE3000L-FGG324 vs A3PE3000-2FG324I 比較
詳細並排比較 A3PE3000L-FGG324 由 Microchip Technology 與 A3PE3000-2FG324I 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ 啟用中Microchip Technology
A3PE3000-2FG324I - ProASIC3E Flash FPGA 35K LEs | Microchip
A3PE3000-2FG324I ✓ 啟用中規格比較
| 參數 | A3PE3000L-FGG324 | A3PE3000-2FG324I |
|---|---|---|
| 品牌 | Microchip Technology | Microchip Technology |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3E |
| System Gates | 3,000,000 | 3M gates |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | — |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | Non-volatile Flash (single chip) |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| 工作電源電壓 | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| 封裝 | 324-BGA / FBGA (FGG324) | — |
| 安裝方式 | SMD/SMT | SMD/SMT |
| 工作溫度 | 0 C to +70 C (commercial) | — |
| Packaging | Tray | Tray |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | — |
| Manufacturer | — | Microchip Technology (Microsemi) |
| Logic Elements (LEs) | — | 35000 LEs |
| Maximum System Performance | — | 310 MHz |
| Process Technology | — | 130 nm flash |
| Core Supply Voltage | — | 1.5 V |
| Number of I/Os | — | 221 I/O |
| 封裝 / 外殼 | — | 324-Ball FBGA |
| Operating Temperature (Min) | — | -40 C |
| Operating Temperature (Max) | — | +85 C |
| Speed Grade | — | -2 |
| Temperature Grade | — | Industrial (I) |
| Product Series | — | A3PE3000 |