A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
MPN： A3PE3000L-FGG324 ✓ 啟用中A3PE3000L-FGG324 概覽
An FPGA (Field-Programmable Gate Array) is a semiconductor device that implements custom digital logic through a fabric of configurable logic blocks (CLBs) connected by programmable interconnects. Unlike SRAM-based FPGAs, the ProASIC3L family stores its configuration in on-chip nonvolatile Flash, giving a single-chip, instant-on solution with no external configuration device required - a key advantage in the programmable logic hierarchy spanning SPLDs, CPLDs, and FPGAs.
Key features of the A3PE3000L include Flash*Freeze technology for ultra-low static power, up to 75,264 configurable logic cells, support for single-ended and differential I/O standards, Schmitt Trigger option on single-ended inputs (A3PE3000L), weak pull-up/pull-downs, and IEEE 1149.1 (JTAG) boundary scan test per the Microchip ProASIC3L datasheet (DS50003268). The device operates from a 1.5V operating supply (commercial range 0C to +70C for this speed grade) with pin-compatible packages across the ProASIC3L family.
Architecturally, the fabric combines VersaTiles with embedded Flash technology built on a standard CMOS process, delivering reprogrammability with inherently low power and high security versus SRAM FPGAs. The low total cost of ownership (TOC) makes the family attractive for high-volume designs where an external boot Flash and power-up configuration time are undesirable.
Typical applications include industrial automation controllers, portable and battery-powered instrumentation, communications line cards, and medical monitoring equipment where the Flash*Freeze mode cuts standby power dramatically.
Designers should budget the 1.2V to 1.5V core rail carefully: lowering VCORE to 1.2V maximizes power savings, while 1.5V supports higher performance up to the 250MHz-class timing limits.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet. Pricing is referenced as of 2026-09-02.
直接替換替代品，適用於 A3PE3000L-FGG324 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE3000L-FGG324 （相同外形與佔位） — 差異在於 Package, Family, Operating Temperature, System Gates, Process Technology.
A3PE3000L-FGG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FGG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-1FG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-FGG324I
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000-2FGG324
✅ 直接替換聯絡詢價
查看資料表 →A3PE3000L-FGG324 最大額定值與電氣特性
| Manufacturer Part Number | A3PE3000L-FGG324 |
| Family | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 |
| Logic Cells (CLBs) | 75264 |
| User I/O | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) |
| Core Voltage Range | 1.2 V to 1.5 V |
| 工作電源電壓 | 1.5 V |
| Maximum Operating Frequency | 250 MHz |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| 封裝 | 324-BGA / FBGA (FGG324) |
| 安裝方式 | SMD/SMT |
| 工作溫度 | 0 C to +70 C (commercial) |
| Packaging | Tray |
A3PE3000L-FGG324 324-bga / fbga (fgg324) 腳位配置指南
A3PE3000L-FGG324（324-bga / fbga (fgg324) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE3000L-FGG324.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE3000L-FGG324 適用於 6 應用s: Industrial Automation and Control, Portable and Battery-Powered Instruments, Medical Monitoring and Diagnostic Equipment, Communications Line Cards and Networking, Avionics and Ruggedized Systems (via -I grade), Video and Display Interface Systems.
Industrial Automation and Control
The A3PE3000L-FGG324 fits industrial controller and I/O-module designs where a single-chip, instantly-on FPGA simplifies the bill of materials and improves field reliability. Its 3M system gates and 75,264 logic cells absorb glue logic, motor PWM sequencing, and safety interlock logic, while 221 user I/Os interface encoders, sensors, and fieldbus transceivers directly. The nonvolatile Flash configuration means no configuration PROM to fail in electrically noisy factory environments, and JTAG boundary scan (IEEE 1149.1) supports production board test. Place the FPGA between the PLC backplane and peripheral drivers with bank voltages matched to 3.3V or 2.5V signaling; the 0C to +70C commercial grade suits cabinet-mounted electronics, while the -I variant covers outdoor or cold-storage installations.
推薦
Portable and Battery-Powered Instruments
Battery-powered test and measurement instruments benefit directly from the A3PE3000L's Flash*Freeze technology: asserting the FLASH_FREEZE pin retains the full FPGA configuration and register state while cutting power to microamp levels between measurements. The 1.2V core option further reduces dynamic energy at moderate clock rates, extending battery runtime versus 1.5V-core SRAM FPGAs that also require a configuration device drawing boot current. With 3 million gates, the device handles display drivers, USB/UART bridging, and DSP front-end preprocessing around a low-power microcontroller host. Designers should sequence the FLASH_FREEZE entry with sensor shutdown to maximize savings, and budget I/O bank voltages at 1.8V to minimize interface power on battery rails.
推薦
Medical Monitoring and Diagnostic Equipment
Patient monitors, portable diagnostic units, and imaging front-ends use the A3PE3000L-FGG324 for deterministic real-time signal aggregation with a secure single-chip FPGA. The nonvolatile Flash fabric resists bitstream interception and powers up instantly when a nurse powers the cart - valuable in emergency settings - while Flash*Freeze keeps the standby rail low during periods when the display sleeps but monitoring must continue. The 221 I/Os connect ECG/SpO2 front-end ADCs, isolation barriers, and alarm indicators; Schmitt Trigger inputs improve noise immunity on long sensor leads. For bedside designs near 0C to +70C limits the commercial grade suffices; choose A3PE3000L-FGG324I for sterilizable or transport hardware subject to wider ambient swings.
推薦
Communications Line Cards and Networking
Access-network line cards, bridge/router control planes, and backplane adapters use the A3PE3000L-FGG324 for protocol bridging, traffic framing, and hot-swap control logic. The 250 MHz-class fabric timing covers OC-x framer glue, TDM switching, and housekeeping state machines, while IEEE 1149.1 boundary scan simplifies in-circuit test of dense 324-ball assemblies. JTAG chain integration with backplane CPUs reduces bring-up time, and the single-chip Flash configuration eliminates configuration PROM programming in repair depots. Keep core at 1.5V for line-rate timing paths and provide solid ground return for the many 2.5V LVDS-class I/O banks; the FGG fine-pitch ball grid array demands controlled-impedance breakout routing on the PCB.
推薦
Avionics and Ruggedized Systems (via -I grade)
While the commercial A3PE3000L-FGG324 targets 0C to +70C, the identical-die A3PE3000L-FGG324I drop-in extends the platform to industrial/extended ranges for ruggedized ground systems, UAV ground stations, and test racks. Flash FPGAs are inherently resistant to configuration upsets compared to SRAM fabrics because the configuration is stored in nonvolatile Flash cells, and the single-chip design removes the configuration-read failure mode in high-vibration environments. Designers implementing gate-array-replacement logic, sensor aggregation, and MIL-STD-style discrete I/O conditioning use the 221 I/Os with Schmitt Trigger inputs for contact debouncing. Always de-rate timing with the Microchip timing models for the selected speed grade and temperature corner.
推薦
Video and Display Interface Systems
Industrial displays, projection controllers, and video-over-LAN encoders employ the A3PE3000L-FGG324 for scan conversion, frame-buffer addressing, and panel timing generation. The 3M-gate fabric implements multiple video pipelines with FIFO depth from on-chip resources, while 221 I/Os drive panel LVDS pairs, backlight PWM, and touch-controller interfaces from independently banked voltages. Instant-on Flash configuration lets the FPGA be ready before the video source completes enumeration, eliminating missed first-frame artifacts seen with SRAM FPGAs that boot from external devices. Buffer incoming video in external SDRAM/LPDDR; keep 1.5V core for pixel-clock timing closure, and reserve Flash*Freeze for standby between source activity windows.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE3000L-FGG324 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE3000L-FGG324I | A3PE3000L-1FGG324I | A3PE3000-FGG324I | A3PE3000-2FGG324 |
|---|---|---|---|---|---|
| Package | 324-BGA (FGG324) | 324-BGA (FGG324) - same | 324-BGA (FGG324) - same | 324-BGA (FGG324) - same | 324-BGA (FGG324) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 221 | 221 | 221 | 221 | 221 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.5 V | 1.5 V |
| Flash*Freeze Mode | Yes | Yes | Yes | No (ProASIC3E) | No (ProASIC3E) |
| Temperature Range | 0 C to +70 C (commercial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) | 0 C to +70 C (commercial) |
| Speed Grade | Standard (-2 class) | Standard | -1 (slower) | Standard | -2 (faster) |
主要差異化特點
- Flash*Freeze ultra-low standby power (對比A3PE3000-FGG324I)
- Wider 1.2V core voltage option (對比A3PE3000-2FGG324)
- Standard speed grade vs -1 (對比A3PE3000L-1FGG324I)
- Commercial price point (對比A3PE3000L-FGG324I)
設計說明
Plan three supply rails: VCORE (1.2V or 1.5V), VJTAG (2.5V), and per-bank I/O voltages (3.3V/2.5V/1.8V/1.5V). Selecting VCORE = 1.2V maximizes battery life via Flash*Freeze pairing, but reduces achievable fabric frequency - verify timing closure at the 1.2V corner in Libero before committing. Estimated: a 3M-gate design at 30% utilization and 50 MHz average toggle can cut dynamic core power roughly in half by dropping from 1.5V to 1.2V (power scales with V-squared). Sequence VCORE before or with I/O banks per the Microchip power-up specification in DS50003268.
The 324-ball fine-pitch FGG package requires via-in-pad or dogbone breakout with 0.2 mm laser vias on 0.8 mm ball pitch; plan at least two signal layers for fanout before routing the 221 user I/Os. Place 100 nF ceramic decoupling within 2 mm of ball-side power/ground pairs, one per bank, plus bulk 10 uF per rail. Follow the ball map in the DS50003268 package mechanical drawing - pin A1 must align with the PCB silk dot and the package chamfer to avoid a mirrored assembly.
Do not treat FG324 and FGG324 as interchangeable footprints without checking the mechanical drawing: the fine-pitch FGG ball pitch differs from the standard FG ball pitch, so a land pattern change is required. Also remember Flash*Freeze requires correct configuration of the FLASH_FREEZE I/O in Libero; asserting it while clocks are running unconstrained can violate I/O timing. Finally, the commercial-grade part is rated 0C to +70C - using it below 0C is out of spec; specify A3PE3000L-FGG324I instead.
For differential I/O standards on banked pins, route matched-length pairs with 3W spacing from single-ended signals and reference an unbroken ground plane. Schmitt Trigger inputs (available on A3PE3000L single-ended inputs) should be enabled for slow edges from optocouplers or mechanical contacts to prevent metastability. Simulate JTAG chain loading if more than four devices share TDI/TDO - the 2.5V VJTAG domain drives the full chain current.
合規資訊
Compliance status not stated in the retrieved distributor snippets; verify RoHS/REACH declarations on the Microchip product compliance portal before export procurement.
