EP2A40F33C-9 vs EP2A40F33I-7 比較
詳細並排比較 EP2A40F33C-9 由 Intel 與 EP2A40F33I-7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2A40F33C-9 | EP2A40F33I-7 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Family | APEX II | — |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| 封裝 | 672-ball FineLine BGA (F33), 1.27 mm pitch | — |
| Speed Grade | -9 | — |
| 工作溫度 | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | Altera APEX II CMOS programmable logic |
| PLLs | 4 | — |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | [DATA_NEEDED: logic element count] |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | — |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | JTAG / serial configuration flash |
| MSL 等級 | 3 | — |
| Peak Reflow Temperature | 220 C | 220 C (Pb-free profile) |
| RoHS 狀態 | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS compliance per PCN] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Device Family | — | APEX II (EP2A) |
| Device Member | — | EP2A40 (high-density) |
| Package Type | — | Fine-pitch BGA (FBGA) |
| Package Pin/Ball Count | — | 33 balls |
| Pitch | — | [DATA_NEEDED: ball pitch] |
| Operating Temperature Grade | — | Industrial (-40 C to +85 C) |
| 濕度敏感等級 (MSL) | — | 3 (per JEDEC J-STD-020) |
| Floor Life at MSL3 | — | 168 hours (factory conditions < 30 C / 60% RH) |
| Design Tool | — | Altera Quartus |
| Lead-Free Reflow Compatible | — | Yes (peak 220 C) |
| Voltage Supply | — | [DATA_NEEDED: VCCINT / VCCIO] |