EP2AGX45DF29C4N - Arria II GX FPGA, 42K LE, 3.5Mb, 780-FBGA | Intel
MPN： EP2AGX45DF29C4N ✓ 啟用中EP2AGX45DF29C4N 概覽
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose architecture comprises configurable logic blocks (LBs/LEs), programmable interconnect, dedicated memory blocks, DSP blocks, and hardened I/O serdes (in modern families). FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> digital IC -> semiconductor), parallel to CPLDs and ASICs. They are widely used for hardware-accelerated DSP, protocol bridging, image processing, and ASIC prototyping where deterministic latency and parallelism matter.
Key features of the EP2AGX45DF29C4N include 8 full-duplex transceiver channels at up to 6.375 Gbps, 8.0/10.3125 Gbps overshoot capability, dedicated 8b/10b encoders, and PCI Express Gen2 (x1/x4) hard IP blocks. The device contains 42959 logic elements, 1805 LABs (Logic Array Blocks), 232 DSP blocks (18x18 multipliers), and 1,541 Kbits of M9K embedded memory plus 656 Kbits of MLAB. It supports up to 16 global clock networks and up to 8 PLLs (4 enhanced + 4 fast) for complex clock-tree synthesis.
The architecture is a 40nm TSMC process with 1.1V core VCC and 0.9V VCCPT auxiliary supply, giving an estimated static power of around 1.5W and substantially higher dynamic power depending on toggle rate and utilization. The device is hardened for protocol support, including PCIe Gen2, Serial RapidIO, Gbps Ethernet, XAUI, CEI-6G, and CPRI, making it a versatile mid-range choice for communications line-cards and video broadcast equipment.
Typical applications include wireless baseband DSP, transport-stream processing for HD-SDI video, high-speed serial protocol bridging (PCIe Gen2 / SRIO / 10GbE), FPGA-based ASIC prototyping, and test-and-measurement instrumentation. Designers favor the Arria II GX family for the price/performance ratio between Cyclone and Stratix and for the embedded transceivers that eliminate external PHY chips.
When designing in this device, plan for multi-rail decoupling close to the ball map, multiple PLL reference clock sources, and thermal management for high utilization workloads. Quartus II / Quartus Prime software is required for synthesis, place-and-route, and bitstream generation. Order a C-speed-grade part (commercial 0C to +85C) versus an I-grade (industrial -40C to +100C) based on deployment environment.
This page synthesizes distributor pricing, drop-in Arria II GX alternatives, and engineering notes not found in the manufacturer datasheet, helping buyers compare sources and select the right speed grade.
直接替換替代品，適用於 EP2AGX45DF29C4N — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2AGX45DF29C4N （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
EP2AGX45DF29C6N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C5N
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29C3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX45DF29C4G
✅ 直接替換聯絡詢價
查看資料表 →EP2AGX45DF29I3N
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP2AGX45DF29C4N 最大額定值與電氣特性
| Series | Arria II GX |
| Device Family | Arria II GX FPGA |
| Logic Elements (LE) | 42,959 |
| Number of LABs | 1805 |
| Embedded Memory (Bits) | 3,517,440 |
| M9K Memory Blocks | 1541 Kbits |
| MLAB Memory | 656 Kbits (configurable as LEs) |
| DSP Blocks (18x18 Multipliers) | 232 |
| Number of Transceivers | 8 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Maximum User I/O | 364 |
| PLL Count | 8 (4 enhanced + 4 fast) |
| Global Clock Networks | Up to 16 |
| Process Technology | 40 nm TSMC |
| Core Voltage (VCC) | 1.1 V |
| Auxiliary Supply (VCCPT) | 0.9 V |
| Speed Grade | C4 (commercial, mid-speed) |
| Temperature Range | 0C to +85C (commercial) |
| 封裝 | 780-ball FBGA (FineLine BGA, 29x29 mm) |
| 安裝類型 | Surface Mount |
| MSL 等級 | 3 |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
EP2AGX45DF29C4N 780-ball fbga (fineline bga, 29x29 mm) 腳位配置指南
EP2AGX45DF29C4N（780-ball fbga (fineline bga, 29x29 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2AGX45DF29C4N.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2AGX45DF29C4N 適用於 6 應用s: Wireless Baseband DSP, HD-SDI Video Transport and Broadcast, PCIe Gen2 Endpoint / Bridge Card, High-Speed Serial Protocol Bridging, ASIC Prototyping Platform, Test and Measurement Instrumentation.
Wireless Baseband DSP
The EP2AGX45DF29C4N fits wireless baseband DSP because its 232 18x18 DSP blocks and 42,959 LEs deliver hundreds of GMACs of multiply-accumulate throughput for LTE and WiMAX baseband processing. The 8 integrated 6.375 Gbps transceivers carry CPRI or OBSAI backhaul between the baseband card and the radio head without external PHYs. Industrial temperature variants (I-grade) suit outdoor small-cell and macro deployments where ambient temperatures swing widely.
推薦
HD-SDI Video Transport and Broadcast
Broadcast equipment uses the EP2AGX45DF29C4N for HD-SDI transport, embedding, and processing because the 6.375 Gbps transceivers handle SD-SDI, HD-SDI, 3G-SDI, and dual-link 3G-SDI cleanly. The 3.5 Mbits of embedded memory buffer line-rate video streams, and the 364 user I/Os connect directly to HDMI/DVI/SDI serializers via LVDS. Designers favor this part over an ASIC because the protocol keeps evolving and reprogrammability is mandatory in broadcast infrastructure.
推薦
PCIe Gen2 Endpoint / Bridge Card
The EP2AGX45DF29C4N implements PCIe Gen2 x1 and x4 endpoints directly using the hardened PCIe hard IP blocks, eliminating the cost and complexity of an external bridge ASIC. The 8 transceivers handle the PCIe lanes plus additional side-band serial protocols such as SATA or 1G Ethernet on a single FPGA. Designers integrate DMA engines, custom drivers, and protocol accelerators inside the 42K LEs to build host-bus adapter cards for test and measurement or storage systems.
推薦
High-Speed Serial Protocol Bridging
Bridge cards using the EP2AGX45DF29C4N translate between serial protocols - such as Serial RapidIO to 10 Gigabit Ethernet, or Aurora to PCIe - by routing data through the 8 transceivers and the on-chip protocol IP. The 232 DSP blocks handle line-rate encoding, scrambling, and forward-error-correction without external co-processors. Compared to a discrete ASSP bridge, an FPGA bridge is reprogrammable for new protocols, making it ideal for defense and industrial networking equipment with evolving standards.
推薦
ASIC Prototyping Platform
Engineers prototype ASIC designs on the EP2AGX45DF29C4N by partitioning logic across multiple FPGAs via the high-density 780-FBGA interconnect. The 42,959 LEs and 3.5 Mbits of block RAM provide enough capacity for large SoC prototypes, while the transceivers model chip-to-chip SERDES links. Quartus II / Quartus Prime export back-annotated timing for ASIC sign-off correlation, and the C4/C5/C6 speed grades let designers trade-off timing closure against emulation cost.
推薦
Test and Measurement Instrumentation
Test-and-measurement gear uses the EP2AGX45DF29C4N for protocol analyzers, logic analyzers, and bit-error-rate testers because of its high-density logic, large embedded memory, and the 8 transceiver channels. Engineers sample multiple serial lanes simultaneously, decode protocols in real time on the DSP blocks, and stream results to host processors. The industrial temperature variants are deployed in field-portable test sets where ambient temperatures vary widely.
推薦
推薦產品摘要
工程參考資料，適用於 EP2AGX45DF29C4N — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2AGX45DF29C6N | EP2AGX45DF29C5N | EP2AGX45DF29C3N | EP2AGX45DF29C4G | EP2AGX45DF29I3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand | Intel (Altera) - same brand |
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Speed Grade | C4 (mid) | C6 (fastest) | C5 (between) | C3 (slowest) | C4 lead-free | I3 (industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Transceiver Channels | 8 (up to 6.375 Gbps) | 8 (up to 6.375 Gbps) | 8 (up to 6.375 Gbps) | 8 (up to 6.375 Gbps) | 8 (up to 6.375 Gbps) | 8 (up to 6.375 Gbps) |
| Embedded Memory (bits) | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| DSP Blocks | 232 (18x18 multipliers) | 232 | 232 | 232 | 232 | 232 |
| Unit Price (qty 1, approx.) | $559 | $640-$680 | $580-$620 | $440-$480 | $555-$600 | $620-$680 |
主要差異化特點
- Mid-range density at 42,959 LEs with 8 integrated 6.375 Gbps transceivers (對比EP2AGX20DF25C4N (smaller sibling))
- Hardened PCI Express Gen2 IP block eliminates external bridge ASICs (對比Cyclone IV GX (lower-end family))
- Speed grade flexibility in identical 780-FBGA footprint (對比EP2AGX65 package variants)
設計說明
Estimated: at typical 30% utilization and 200 MHz toggle rate, total on-chip power is roughly 3-5W with transceivers contributing 0.5-1W per active channel. Decouple the four core rails (VCC, VCCPT, VCCA_PLL, VCCD_PLL) with 0.1uF X7R ceramics placed within 5mm of the ball. Use a 4-layer PCB with at least one solid ground plane for return-current continuity beneath the FBGA.
Route the eight high-speed transceiver channels with 100-ohm differential impedance, length-matched within 0.13mm (10ps) for data and within 0.5mm for clock-to-data. Place the AC-coupling capacitors within 4mm of the transmit balls. Keep LVDS and other noisy signals at least 5mm away from the SERDES region to meet the 6.375 Gbps eye-mask budget.
Estimated: at 5W total dissipation and a typical 780-FBGA theta_JA of 12-15 C/W with sufficient PCB copper, junction temperature rise is roughly 60-75C above ambient. For industrial-temperature variants this is acceptable; for enclosed chassis with poor airflow, attach a heatsink or use 8 thermal vias under the central 6x6 BGA ball array to drop theta_JA to 6-8 C/W.
Do not omit the VCC_PGM supply on the JTAG/AS configuration pins, or configuration will fail intermittently. Do not connect VCCPD to a supply other than 1.8V, 2.5V, 3.0V, or 3.3V matching the bank I/O standard. Ensure MSEL pins are correctly strapped for the desired configuration mode (AS, PS, JTAG, or Fast Passive Parallel) before powering up - misconfiguration is the most common bring-up failure.
合規資訊
RoHS and REACH compliance per Altera/Intel product page (Altera parts transitioned to Intel branding circa 2015). Halogen-free status not explicitly listed in the available web data. Not AEC-Q100 qualified - FPGAs are not typical automotive-grade devices.
