EP2AGZ225FF35I3N vs EP2AGZ225FF35I4G 比較
詳細並排比較 EP2AGZ225FF35I3N 由 Intel 與 EP2AGZ225FF35I4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGZ225FF35I3N | EP2AGZ225FF35I4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | Yes (per Arria II GZ family) |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| 工作溫度 | -40C to +100C (Industrial) | — |
| 封裝 | 1152-ball FC-FBGA | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| MSL 等級 | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements | — | ~224,000 LE |
| Process Node | — | 40 nm |
| Number of I/O | — | 554 user I/O |
| Package Type | — | 1152-ball FineLine BGA (FBGA) |
| Package Code | — | FF35 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | I4 |
| 供應電壓 | — | [DATA_NEEDED: core VCC voltage] |
| Embedded Transceivers | — | Multi-gigabit (per datasheet) |
| DSP Blocks | — | Yes (per Arria II GZ family) |
| PCI Express Hard IP | — | Yes (Gen1/Gen2) |
| External Memory Interface | — | DDR3 controller (per family) |
| Lead-Free | — | Yes (per distributor listing) |