EP2AGZ225FF35I3N vs EP2AGZ225FF35I4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ225FF35I3N disebabkan oleh Intel dan EP2AGZ225FF35I4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ225FF35I3N | EP2AGZ225FF35I4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | Yes (per Arria II GZ family) |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Suhu Operasi | -40C to +100C (Industrial) | — |
| Kemasan | 1152-ball FC-FBGA | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Aras MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements | — | ~224,000 LE |
| Process Node | — | 40 nm |
| Number of I/O | — | 554 user I/O |
| Package Type | — | 1152-ball FineLine BGA (FBGA) |
| Package Code | — | FF35 |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | I4 |
| Tegangan Pemberi Arus | — | [DATA_NEEDED: core VCC voltage] |
| Embedded Transceivers | — | Multi-gigabit (per datasheet) |
| DSP Blocks | — | Yes (per Arria II GZ family) |
| PCI Express Hard IP | — | Yes (Gen1/Gen2) |
| External Memory Interface | — | DDR3 controller (per family) |
| Lead-Free | — | Yes (per distributor listing) |