EP2S180F1020C3 vs EP2S180F1020I4 比較
詳細並排比較 EP2S180F1020C3 由 Intel 與 EP2S180F1020I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S180F1020C3 | EP2S180F1020I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | Stratix II | Stratix II |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | — |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| 封裝 | 1020-ball FBGA (flip-chip BGA) | 1020-BBGA, FC-FBGA (Flip-Chip FineLine BGA) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C3 | — |
| 工作溫度 | Commercial (0C to +85C) | -40C to +100C (Industrial grade, "I4" suffix) |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | Passive serial, Active serial, Fast passive parallel, JTAG |
| Development Toolchain | Quartus II / Quartus Prime | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Stratix II (EP2S180) |
| Logic Elements | — | 179,400 |
| Number of LABs/CLBs | — | 8,970 |
| Total RAM Bits | — | 9,383,040 (8,979,840 per alternate sources) |
| Number of I/O | — | 742 |
| Number of DSP Blocks | — | [DATA_NEEDED: DSP block count per Stratix II EP2S180 datasheet - typically 12] |
| Number of PLLs | — | [DATA_NEEDED: PLL count per EP2S180 datasheet] |
| Core Voltage (VCCINT) | — | 1.2 V |
| Process Technology | — | 90 nm CMOS |
| Maximum Operating Frequency | — | 711.24 MHz |
| MSL 等級 | — | [DATA_NEEDED: MSL rating from Altera packaging spec] |
| Lead-Free | — | Yes |
| Configuration Memory Type | — | SRAM (volatile; requires external configuration device) |
| Supplier Device Package | — | 1020-FBGA |
| Base Part Number | — | EP2S180 |