EP2SGX30DF780C4 - Stratix II GX FPGA 33.8K LE FBGA-780 | Intel
MPN： EP2SGX30DF780C4 ✗ 停產EP2SGX30DF780C4 概覽
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the customer after manufacture. Within the broader taxonomy, the Stratix II GX belongs to the high-performance FPGA category, sitting between traditional PLDs and ASICs in cost-per-volume while delivering ASIC-class DSP, memory, and transceiver bandwidth. It functions as a system-on-chip engine for parallel DSP, packet processing, and high-speed I/O bridging in communications, imaging, and test systems.
Key features include 1,694 LABs/CLBs and 33,880 logic elements, 20 embedded full-duplex transceivers with multi-gigabit capability, dedicated DSP blocks for high-throughput arithmetic, and 361 user I/Os with multi-standard support. The device targets -40 °C to +85 °C extended commercial operating range (C4 grade) and is fabricated on a 90 nm CMOS process for a balance of density and dynamic power.
Architecturally, the Stratix II GX combines a row-and-column-based adaptive logic module (ALM) fabric with hard PCIe, memory controller IP, and multi-gigabit transceivers (MGTs), eliminating soft logic for the most timing-critical paths. The 90 nm CMOS process provides adequate headroom for the on-die PLL and clock tree while keeping static leakage manageable.
Typical applications include high-end telecommunications line cards, software-defined radio (SDR), ASIC prototyping, broadcast video processing, and high-speed serial backplane bridging. The combination of 20 transceivers and 33.8K logic elements also makes it suitable for medical imaging pre-processors and defense radar front-ends.
When designing with this device, careful attention must be paid to power-rail sequencing (1.2 V core, 2.5 V/3.3 V aux) and multi-layer PCB stack-up to keep transceivers within their SI budgets. The FBGA-780 demands a minimum of 6 PCB layers with controlled-impedance routing for the MGT channels.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for evaluation, sourcing, and BOM hardening.
直接替換替代品，適用於 EP2SGX30DF780C4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP2SGX30DF780C4 （相同外形與佔位） — 差異在於 Operating Temperature, Package, RoHS Status, Speed Grade, Mounting Type.
EP2SGX30DF780C4N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX30DF780C3N
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX30DF780C3
✅ 直接替換聯絡詢價
查看資料表 →EP2SGX30DF780C4 最大額定值與電氣特性
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Cells | 33,880 |
| Number of LABs / CLBs | 1,694 |
| Total Number of I/Os | 361 |
| Maximum Operating Frequency | 717 MHz |
| Number of Transceivers | 20 (embedded multi-gigabit) |
| Core Voltage | 1.2 V |
| 封裝 | FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) |
| 安裝類型 | Surface Mount |
| Process Technology | 90 nm CMOS |
| Operating Temperature Grade | Commercial (C4) |
| Programmable Terminals | BGA ball grid (780 terminals) |
| Package Code | BGA |
| Package Shape | Square |
| RoHS 狀態 | Compliant (per manufacturer product page) |
| Lead-Free | Yes |
EP2SGX30DF780C4 square 腳位配置指南
EP2SGX30DF780C4（square 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP2SGX30DF780C4.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP2SGX30DF780C4 適用於 6 應用s: Telecommunications Line Cards, Software Defined Radio (SDR), ASIC Prototyping, Broadcast Video Processing, High-Speed Serial Backplane Bridging, Medical Imaging Pre-Processor.
Telecommunications Line Cards
The EP2SGX30DF780C4 is ideally suited for high-end telecom line cards requiring simultaneous multi-gigabit serial I/O and substantial parallel processing. With 20 embedded transceivers supporting PCI Express Gen1/Gen2, Serial RapidIO, XAUI, and CPRI, plus 33,880 logic elements to handle framer, MAC, and traffic-management functions, the device bridges backplane serial links at up to 6.375 Gbps. The 361 user I/Os provide generous parallel connectivity to external PHYs and lookup memories. Unlike fixed-function ASSPs, the FPGA fabric lets OEMs re-target the same hardware across multiple line-card SKUs, reducing inventory cost. Power dissipation is the main trade-off - the 90 nm process and full transceiver utilization require robust thermal management on the line card PCB.
推薦
Software Defined Radio (SDR)
Software-defined radio platforms benefit from the EP2SGX30DF780C4's combination of high logic density and embedded multi-gigabit transceivers. The 33,880 logic elements host multi-channel digital down-conversion (DDC), digital up-conversion (DUC), and FFT processors, while the 20 transceivers interface directly to ADC/DAC sample clocks and IF stages. This eliminates an external bridging ASIC, reducing BOM and latency. The 1.2 V core at 717 MHz provides adequate DSP throughput for sub-6 GHz waveform processing in tactical and commercial SDR designs. The 90 nm CMOS process trades some power efficiency for cost-effective density, which suits chassis-mounted radios with active cooling rather than handheld form factors.
推薦
ASIC Prototyping
The EP2SGX30DF780C4 serves as a high-fidelity ASIC prototyping platform thanks to its 33,880 logic elements, dedicated DSP blocks, and embedded transceivers. Design teams partition the target ASIC into multiple Stratix II GX devices using the same FBGA-780 footprint for repeatable bring-up. The 717 MHz core frequency provides timing margin to validate RTL at near-ASIC speeds, while 361 user I/Os enable realistic chip-to-chip signaling. The same Quartus II toolchain that targets production ASICs accelerates verification cycles. Because the part is End-of-Life, prototype teams should secure long-term inventory or migrate to Stratix IV/V GX before committing to a multi-year program.
推薦
Broadcast Video Processing
Broadcast video processing engines rely on the EP2SGX30DF780C4 for real-time SD/HD/3G-SDI ingest, de-interlacing, scaling, and overlay composition. The 20 multi-gigabit transceivers accept uncompressed SDI streams at up to 3 Gbps per link, while the 33,880 logic elements drive multi-stream processing pipelines without external memory bottlenecks. The 361 user I/Os interface to DDR2/DDR3 frame buffers and HDMI/DVI output bridges. Compared with fixed ASSP video processors, the FPGA fabric supports proprietary codecs and watermark insertion critical to broadcast IP protection. Designers should plan for thermal management and multi-layer PCB impedance control to maintain SDI eye-mask compliance at production volumes.
推薦
High-Speed Serial Backplane Bridging
Backplane bridging applications use the EP2SGX30DF780C4 as a protocol-agnostic serial aggregator across ATCA, microTCA, and proprietary backplanes. The 20 embedded transceivers aggregate multiple lanes of Gigabit Ethernet, Serial RapidIO, or Aurora into a single high-bandwidth pipe, while 33,880 logic elements implement link-layer arbitration and congestion management. The FBGA-780 footprint integrates cleanly into standard ATCA carrier cards with room for PHY magnetics and clock distribution. The device is especially valuable in defense and aerospace backplanes where the same hardware must bridge multiple protocols on the same chassis, eliminating dedicated silicon per protocol.
推薦
Medical Imaging Pre-Processor
Medical imaging systems such as CT, MRI, and ultrasound pre-processors rely on the EP2SGX30DF780C4 for high-throughput pixel pipeline and beamforming operations. The 33,880 logic elements execute FIR/IIR filtering, image reconstruction, and noise reduction in real time, while 20 embedded transceivers carry raw ADC data from the detector array at multi-gigabit rates. Compared with DSP-only solutions, the FPGA fabric offers deterministic latency essential for triggering and gating. The 361 user I/Os accommodate multiple high-resolution sensor interfaces in parallel. Given the EOL status of this part, medical OEMs typically lock in long-term inventory contracts or migrate to lower-density Stratix IV/V parts.
推薦
推薦產品摘要
工程參考資料，適用於 EP2SGX30DF780C4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP2SGX30DF780C4N | EP2SGX30DF780C3N | EP2SGX30DF780C3 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29 x 29 mm, 1 mm pitch) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 |
| LABs / CLBs | 1,694 | 1,694 | 1,694 | 1,694 |
| Speed Grade | C4 | C4 | C3 (lower) | C3 (lower) |
| Lead-Free / RoHS | Per datasheet (status not explicitly stated in verified web data) | Yes (lead-free finish) | Yes (lead-free finish) | Per datasheet (status not explicitly stated) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/Os | 361 | 361 | 361 | 361 |
| Transceivers | 20 | 20 | 20 | 20 |
| Lifecycle Status | EOL | EOL | EOL | EOL |
主要差異化特點
- Same die, faster speed grade at identical price point (對比EP2SGX30DF780C3)
- Lead-free / RoHS-compliant ball finish for global manufacturing (對比EP2SGX30DF780C4 (standard lead finish))
- 20 embedded multi-gigabit transceivers eliminate external bridging silicon (對比Discrete PHY-based designs using ASSP bridges)
設計說明
The Stratix II GX family requires four independent supply rails: 1.2 V VCCINT (core), 2.5 V VCCAUX (PLL and auxiliary), 3.3 V VCCIO (I/O banks - mixed voltage possible), and a separate analog supply for the multi-gigabit transceivers. Power-rail sequencing must enforce VCCINT before VCCAUX before VCCIO, with monotonic ramp and <100 ms rise time. Failure to sequence correctly risks latch-up or long-term reliability degradation. Estimated: at full transceiver utilization the device can dissipate 8-12 W, requiring a multi-layer PCB with at least 1 oz copper pour on inner planes.
The FBGA-780 package demands a minimum 6-layer PCB stack-up with 1 mm ball pitch escape routing. Use microvia (laser-drilled) or stacked-via technology on the top two layers to break out the inner-row balls. Transceiver lanes must be routed as 100 Ω differential pairs on a controlled-impedance stack-up (typical stack: 8 mil dielectric, 0.5 oz copper). Keep MGT traces shorter than 6 inches and avoid 90-degree bends to preserve 6.375 Gbps eye-mask margins. Place AC-coupling capacitors within 200 mil of the receiver balls.
Three pitfalls to avoid with the EP2SGX30DF780C4. First, do not assume the C4 (speed grade 4) is the fastest - the lowest number is fastest (C3 > C4 > C5 in performance). Confirm speed grade timing closure in Quartus II TimeQuest before tape-out. Second, unused MGT transceivers must still be powered and properly terminated per the handbook; floating balls cause reflections and can inject noise into adjacent active channels. Third, the JTAG and configuration pins (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) require external pull-up/pull-down resistors per the configuration scheme - missing pull-ups result in unreliable configuration at power-up.
合規資訊
RoHS compliance per manufacturer product page (Stratix II GX family data). Detailed reach/halogen/conflict-mineral declarations for EP2SGX30DF780C4 were not available in the verified web data. The C4N suffix variant is explicitly lead-free per Altera/Intel ordering information.
