EP2SGX90FF1508C3ES vs EP2SGX90FF1508C3 比較
詳細並排比較 EP2SGX90FF1508C3ES 由 Intel 與 EP2SGX90FF1508C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
EP2SGX90FF1508C3ES ObsoleteIntel
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
EP2SGX90FF1508C3 Obsolete規格比較
| 參數 | EP2SGX90FF1508C3ES | EP2SGX90FF1508C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 90,960 | 90,960 |
| Logic Array Blocks (LABs) | 4,828 | — |
| Embedded Memory (TriMatrix) | 4,520,448 bits | — |
| Total RAM Bits | 4,520,448 | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| Maximum Internal Frequency | 816.9 MHz | — |
| DSP Blocks | Yes (dedicated multiplier blocks) | — |
| Embedded Transceivers | Up to 3.125 Gbps multi-gigabit transceivers | — |
| Global Clock Networks | Up to 16 | — |
| Regional Clock Networks | Up to 32 per device region | — |
| 封裝 | 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch | — |
| 安裝類型 | Surface Mount | Surface Mount (Tray) |
| Configuration Interface | JTAG / EPCS serial flash / Passive parallel | — |
| Operating Temperature Grade | Commercial / Industrial (per part suffix) | — |
| RoHS 狀態 | [DATA_NEEDED: rohs] | Compliant |
| LABs / CLBs | — | 4,548 |
| Total Memory Bits | — | 4,520,448 |
| Maximum User I/O | — | 650 |
| Number of Transceivers | — | 4 (per family datasheet) |
| Core Voltage | — | 1.2 V |
| 工作溫度 | — | 0C to +85C (commercial) |
| Speed Grade | — | -3 |
| Package Type | — | 1508-ball FC-FBGA (FBGA-1508) |
| Package Dimensions | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Method | — | SRAM-based, JTAG / Passive / Active serial |