EP3C25F324C8N vs EP3C25F324C6N 比較

詳細並排比較 EP3C25F324C8N 由 Intel 與 EP3C25F324C6N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3C25F324C8N EP3C25F324C6N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone III Cyclone III (low-power, low-cost FPGA)
Series Cyclone III Cyclone III
Logic Elements (LEs) 24,624 —
Total Memory Bits 608,256 bits 608,256 bits
Embedded Memory (Kbits) 608 Kbits —
Number of I/O 215 —
封裝 324-BGA (FineLine) 324-BGA (FBGA-324), fine-pitch
Supply Voltage - Core 1.2 V —
安裝類型 Surface Mount Surface Mount
工作溫度 0 C to +85 C (commercial, suffix C) 0C to +85C (commercial)
Speed Grade 8 C6 (commercial)
Total RAM Bits 608,256 —
Process Node 60 nm low-power CMOS —
Number of Multipliers (18x18) 66 —
Number of PLLs 4 —
RoHS 狀態 Compliant —
Logic Elements (LE) — 24,624
Embedded Memory Blocks — M9K blocks, 66 total
Embedded Multipliers — 66 (18x18)
DSP Blocks — 66 dedicated 18x18 multipliers
User I/O Pins — 215
Number of I/O Banks — 8
PLLs — 4 general-purpose PLLs
Process Technology — TSMC 65 nm low-power (LP)
Configuration Schemes — Passive Serial, Fast Passive Parallel, JTAG
Lead-Free / RoHS — Yes (lead-free, RoHS compliant)

資料表與資源

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