EP3SE110F780I4L vs EP3SE110F780C4N 比較

詳細並排比較 EP3SE110F780I4L 由 Intel 與 EP3SE110F780C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE110F780I4L EP3SE110F780C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III E Stratix III
Logic Elements 107,500 —
LABs (Logic Array Blocks) 4,300 —
User I/Os 488 —
Embedded Memory 8,936,448 bits (8.9 Mbit) —
Maximum Operating Frequency 375 MHz —
Process Technology 65 nm CMOS —
Core Voltage 0.9 V —
封裝 780-pin FC-FBGA (Flip-Chip BGA) —
Package Body Size 29 mm × 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature (Industrial) -40 °C to +100 °C —
安裝類型 Surface Mount (FC-FBGA) Surface Mount
RoHS 狀態 Compliant (per legacy Altera data) Compliant
Product Status Not Recommended for New Designs (NRND) —
Series — Stratix III E
Logic Elements (LEs) — 107500
Embedded Memory Bits — 8936448
User I/O Count — 488
Number of Terminals — 780
Package Type — 780-BBGA, FCBGA
Package Code — BGA
Terminal Form — Ball
Package Shape — Square
Speed Grade — C4
工作溫度 — 0C to 85C (Commercial)
Process Node — 65 nm
Configuration Mode — PS / FPP / JTAG

資料表與資源

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