EP3SE260F1517C4 vs EP3SE260F1517C3N 比較

詳細並排比較 EP3SE260F1517C4 由 Altera 與 EP3SE260F1517C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C4 EP3SE260F1517C3N
品牌 Altera Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 最後購買
Series Stratix III E —
Family Stratix® III E FPGA Stratix III E
Logic Elements (LE) 255,000 —
Adaptive Logic Modules (ALM) 10,200 LABs / 10200 ALMs (per Mouser listing) —
Embedded Memory (bits) 16,672,768 —
User I/O Count 976 —
DSP Blocks 768 (18x18 multipliers per Mouser listing) —
封裝 1517-BBGA, FCBGA 1517-BBGA (FCBGA)
Ball Count 1517 —
Package Style Flip-Chip BGA —
安裝類型 Surface Mount Surface Mount
Speed Grade -4 C3 (commercial)
工作溫度 Commercial (0C to +85C) - inferred from C4 suffix —
Process Node 40 nm —
RoHS 狀態 Compliant (per Altera product page) Compliant
Lead-Free Yes —
Logic Elements — 254,400
Embedded Memory — 16,672,768 bits (16.7 Mbits)
User I/Os — 976
DSP Blocks (18x18 Multipliers) — 816
M9K Memory Blocks — 1,040
Maximum Transceiver Data Rate — 600 Mbps
PLLs — 4
Global Clock Networks — 16
Process Technology — 65 nm TSMC low-power CMOS
工作接面溫度 — 0 C to +85 C (commercial)
External Memory Interfaces — DDR3, DDR2, QDRII+, RLDRAM2

資料表與資源

瀏覽所有產品 建立 BOM 索取報價