EP3SE260H780I4LG vs EP3SE260H780C4L 比較
詳細並排比較 EP3SE260H780I4LG 由 Intel 與 EP3SE260H780C4L 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4LG | EP3SE260H780C4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | NRND |
| Series | Stratix III Enhanced | — |
| Family | EP3SE260 | Stratix III E |
| Logic Elements | 255,000 LE | 255,000 |
| Adaptive Logic Modules (ALMs) | 102,000 ALM | — |
| Embedded Memory | 15.90 Mbit | — |
| DSP Blocks | 304 | — |
| 18x18 Multipliers | 840 | — |
| User I/O | 488 | — |
| PLLs | 8 (4 fractional + 4 general-purpose) | — |
| Speed Grade | -4 | C4 (middle/slow tier) |
| Temperature Grade | Industrial (I) | — |
| 封裝 | 780-ball FineLine BGA (HBGA) | 780-ball FCBGA (HBGA 33x33 mm) |
| 工作溫度 | -40C to +100C | — |
| Process Technology | 65 nm low-power CMOS | — |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| LABs/CLBs | — | 10,200 |
| Total RAM Bits | — | 16,672,768 (16.7 Mbit) |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V (nominal) |
| 工作接面溫度 | — | 0C to +85C (commercial) |
| 安裝類型 | — | Surface Mount (flip-chip BGA) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |
| RoHS 狀態 | — | Compliant (lead-free per datasheet) |
| Transceivers | — | Up to 24 multi-gigabit transceivers |
| Memory Interface | — | DDR3, DDR2, QDRII+, RLDRAM II controllers |
| Configuration Mode | — | PS, FPP, JTAG with EPCS/EPCQ |