EPF10K100EBC356-2 vs EPF10K200SBC356-2X 比較
詳細並排比較 EPF10K100EBC356-2 由 Intel 與 EPF10K200SBC356-2X 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoleteIntel
EPF10K200SBC356-2X - FLEX 10K 200K Gates FPGA, 274 I/O, 356-BGA | Intel/Altera
EPF10K200SBC356-2X Nrnd規格比較
| 參數 | EPF10K100EBC356-2 | EPF10K200SBC356-2X |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Series | FLEX-10KE | FLEX-10KS |
| Family | Embedded Programmable Logic Device (PLD) | FLEX 10K |
| Typical Gates | 100,000 | — |
| Maximum System Gates | 158,000 | — |
| Logic Elements (LEs) | 4,992 | — |
| Number of LABs/CLBs | 624 | — |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 49,152 | — |
| User I/O Pins | 274 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) | — |
| Propagation Delay (tPD) | 0.5 ns | — |
| Internal Operating Frequency | up to 250 MHz | — |
| Process Technology | CMOS, SRAM-based | CMOS 0.22 µm |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) | — |
| 工作溫度 | 0 C to 70 C (Commercial) | 0 °C to +70 °C (commercial) |
| 安裝類型 | Surface Mount | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) | SRAM-based, requires external configuration device (EPC2/EPC8) |
| Speed Grade | -2 | -2 |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 9984 |
| Approximate Gate Count | — | 200,000 |
| Logic Array Blocks (LABs) | — | 1248 |
| User I/O Count | — | 274 |
| 封裝 | — | 356-LBGA (35x35 mm, 1.27 mm pitch) |
| 供應電壓 | — | 2.375 V to 2.625 V (core) |
| Propagation Delay (typ.) | — | 0.4 ns |
| Lead Free Status / RoHS | — | RoHS non-compliant (per third-party listing) |
| In-System Programmability | — | Yes (via JTAG or serial interface) |