EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
MPN： EPF10K100EBC356-2 ✗ 停產EPF10K100EBC356-2 概覽
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, and I/O cells that can be re-programmed to implement custom digital logic. The FLEX-10KE family introduced by Altera pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding dedicated array blocks (EABs) alongside the general-purpose logic fabric, providing on-chip RAM and DSP megafunctions. In the broader hierarchy, the EPF10K100EBC356-2 sits within: programmable logic device -> CPLD/FPGA -> SRAM-based FPGA -> embedded-array FPGA.
Key features of the EPF10K100EBC356-2 include its 2.5 V core supply (speed grade -2), 0.5 ns internal propagation delay, CMOS process technology, and full JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. The 356-ball LBGA package provides high I/O density (274 user I/O) for multi-bank designs, while the 12 EABs deliver 49,152 bits of true dual-port RAM suitable for FIFOs, lookup tables, and small buffer memories. The -2 speed grade represents Altera's mid-tier timing bin, suitable for designs targeting up to 250 MHz internal performance.
Typical applications include telecommunications line cards, industrial control and factory automation controllers, military/aerospace signal processing, medical imaging back-end processing, and legacy ASIC prototyping. The embedded array blocks make the FLEX 10KE particularly well-suited to designs requiring on-chip memory integration alongside glue logic, eliminating external SRAM in many mid-complexity designs.
When designing with this part, ensure that the 2.5 V core supply is decoupled with 0.1 uF ceramic capacitors placed within 5 mm of every VCC/GND pair. Configuration data must be loaded from a serial or parallel PROM at power-up via the dedicated configuration pins. The commercial temperature grade (0 to 70 C) limits deployment to non-automotive, non-extended-temperature environments.
直接替換替代品，適用於 EPF10K100EBC356-2 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EPF10K100EBC356-2 （相同外形與佔位） — 差異在於 Operating Temperature, Process Technology, Logic Array Blocks (LABs), Family, Package.
EPF10K100EBC356-2N
✅ 直接替換📋 參考替代品（不在目錄中）
EPF10K100EBC356-2X
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EBC356-1
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EBC356-1N
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EBC356-1X
✅ 直接替換聯絡詢價
查看資料表 →EPF10K100EBC356-2 最大額定值與電氣特性
| Series | FLEX-10KE |
| Family | Embedded Programmable Logic Device (PLD) |
| Typical Gates | 100,000 |
| Maximum System Gates | 158,000 |
| Logic Elements (LEs) | 4,992 |
| Number of LABs/CLBs | 624 |
| Embedded Array Blocks (EABs) | 12 |
| Total RAM Bits | 49,152 |
| User I/O Pins | 274 |
| Supply Voltage (Core) | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | 0.5 ns |
| Internal Operating Frequency | up to 250 MHz |
| Process Technology | CMOS, SRAM-based |
| Package Type | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| 工作溫度 | 0 C to 70 C (Commercial) |
| 安裝類型 | Surface Mount |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Speed Grade | -2 |
EPF10K100EBC356-2 356-lbga (35 x 35 mm, 1.27 mm pitch) 腳位配置指南
EPF10K100EBC356-2（356-lbga (35 x 35 mm, 1.27 mm pitch) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EPF10K100EBC356-2.
請參閱 資料表 以查看完整腳位配置。
典型應用
EPF10K100EBC356-2 適用於 6 應用s: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Design Verification, Military and Aerospace Avionics (Legacy Programs), Medical Imaging Back-End Processing, Legacy Test and Measurement Instrumentation.
Telecommunications Line Cards
The EPF10K100EBC356-2 fits mid-complexity telecom line-card designs where its 4,992 logic elements, 49,152 RAM bits across 12 EABs, and 274 user I/O are sufficient for glue logic, protocol adaptation, and small packet buffers. Its 250 MHz internal frequency and 0.5 ns propagation delay support TDM bus interfacing and serial-link state machines. The 356-LBGA's high I/O count accommodates multi-standard PHY interfaces (T1/E1, Ethernet MAC glue) within a single device.
推薦
Industrial Control and Factory Automation
The EPF10K100EBC356-2 suits industrial controllers that require deterministic glue logic, custom interface bridging, and small on-chip FIFOs. Its 12 embedded array blocks deliver 49,152 bits of true dual-port RAM, eliminating external SRAM in many PLC, motor-control, and process-instrumentation designs. The commercial 0 to 70 C temperature range and 2.5 V core are compatible with industrial 3.3 V rails via a linear regulator, while 274 I/O handle multi-protocol industrial buses.
推薦
ASIC Prototyping and Design Verification
Engineers used the EPF10K100EBC356-2 extensively as an ASIC prototype vehicle because its 4,992 LEs and 49,152 embedded RAM bits approximate mid-range gate-array densities. The 356-LBGA package provides generous I/O for emulating ASIC pad-ring layouts. Quartus II synthesis and the IEEE 1149.1 JTAG interface allow rapid design iteration. This remains a useful application for legacy ASIC verification flows still in production.
推薦
Military and Aerospace Avionics (Legacy Programs)
The EPF10K100EBC356-2 served many legacy military and aerospace platforms where its SRAM-based programmability enabled field upgrades of mission logic. The 100K-gate density, 274 I/O, and embedded RAM made it suitable for radar signal preprocessing, navigation interface glue logic, and flight-control instrumentation. While the commercial temperature grade limits new programs, existing defense platforms continue to use this part via Rochester Electronics' long-term support.
推薦
Medical Imaging Back-End Processing
The EPF10K100EBC356-2's 12 EABs providing 49,152 RAM bits make it well-suited to medical imaging back-end pipelines where it implements line buffers, lookup tables for gamma correction, and small FIFO queues between image sensors and DSPs. The 250 MHz internal frequency supports real-time pixel-rate processing for ultrasound and endoscopy front-ends. Its low-power 2.5 V core (versus 3.3 V alternatives) reduces thermal load in compact patient-adjacent equipment.
推薦
Legacy Test and Measurement Instrumentation
The EPF10K100EBC356-2 is used in legacy test-and-measurement instruments such as logic analyzers, protocol exercisers, and bench-top signal generators where its 4,992 LEs provide ample capacity for custom stimulus generation and protocol decoding. The 274 user I/O support parallel bus capture and pattern generation. Many of these instruments remain in service, driving continued demand for the part on the secondary market via distributors like Rochester Electronics.
推薦
推薦產品摘要
工程參考資料，適用於 EPF10K100EBC356-2 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EPF10K100EBC356-2N | EPF10K100EBC356-2X | EPF10K100EBC356-1 | EPF10K100EBC356-1N | EPF10K100EBC356-1X |
|---|---|---|---|---|---|---|
| Package | 356-LBGA (35x35 mm) | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same | 356-LBGA (35x35 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | -2 (mid tier) | -2 (mid tier) | -2 (mid tier) | -1 (slower) | -1 (slower) | -1 (slower) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| User I/O | 274 | 274 | 274 | 274 | 274 | 274 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Core Voltage | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) | 2.5 V (2.375-2.625 V) |
| Lifecycle Status | Obsolete | Obsolete (Rochester authorized) | Obsolete | Obsolete | Obsolete | Obsolete |
主要差異化特點
- Drop-in pin-compatible with -1 and -N speed/finish variants (對比EPF10K100EBC356-1)
- 12 embedded array blocks with 49,152 RAM bits (對比EPF10K130EBC356-2)
- 274 user I/O in a 356-LBGA (對比EPF10K100BFC256-2 (256-BGA))
設計說明
The EPF10K100EBC356-2 requires a low-noise 2.5 V core supply (2.375 V to 2.625 V) capable of delivering peak inrush current during SRAM configuration. Decouple with at least one 10 uF tantalum or polymer bulk capacitor plus four 0.1 uF ceramic capacitors placed within 5 mm of the VCC/GND ball pairs around the 356-LBGA perimeter. Power sequencing is not required because the device is SRAM-based - however, ramp time should not exceed the datasheet limit to avoid latch-up. A dedicated linear regulator (e.g., LT1764 or TPS7A45) is recommended over a switching regulator to minimize core noise on PLL inputs.
The 356-LBGA package has 1.27 mm ball pitch requiring 0.6 mm via land and microvia technology on the BGA fan-out layer. Route all high-speed signals on inner layers with controlled impedance (50 ohm single-ended, 100 ohm differential). Maintain at least 8 mil clearance from adjacent BGA balls to avoid solder-bridge defects at assembly. The exposed die-attach paddle improves thermal performance; connect it to a continuous ground plane with at least 16 thermal vias to the bottom layer.
Configuration data loss is the most common failure mode: SRAM-based FLEX 10KE devices lose all logic contents on power-down and must be reconfigured at every power-up from a serial or parallel configuration PROM (EPC1, EPC2, EPC4, EPC8, or EPC16 family). Do not attempt to use a non-Altera PROM - the FLEX 10KE configuration timing is proprietary. When migrating designs, verify that the new bitstream is recompiled for the exact speed grade (-1 vs -2) and silicon revision, otherwise hold-time violations may occur in high-speed paths.
合規資訊
RoHS/REACH/lead-free status not present in verified web data; the EPF10K100EBC356-2N suffix per Altera's ordering code typically denotes Pb-free finish. AEC-Q100 not applicable (commercial-grade FPGA).
