H5AN8G8NCJR-VKC vs MT40A1G8AG-062E 比較

詳細並排比較 H5AN8G8NCJR-VKC 由 SK hynix 與 MT40A1G8AG-062E 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5AN8G8NCJR-VKC H5AN8G8NCJR-VKC - 8Gb DDR4-2666 SDRAM x8 | SK hynix

H5AN8G8NCJR-VKC - 8Gb DDR4-2666 SDRAM x8 | SK hynix

H5AN8G8NCJR-VKC ✓ 啟用中
Micron Technology
MT40A1G8AG-062E MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E ✓ 啟用中

規格比較

參數 H5AN8G8NCJR-VKC MT40A1G8AG-062E
品牌 SK hynix Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM (volatile) DDR4 SDRAM
記憶體容量 8 Gbit 8 Gbit
Memory Organization 1G x 8 —
資料速率 2666 Mbps/pin —
Clock Frequency 1.6 GHz 1.6 GHz (DDR4-3200, 3200 MT/s data rate)
Supply Voltage (VDD) 1.14 V to 1.26 V (1.2 V class) 1.2 V
Operating Current (typ) 30 mA —
Standby Current (typ) 3 mA —
工作溫度 0C to +85C —
封裝 FBGA-78 (78-ball fine-pitch BGA) 78-FBGA (7.5 x 11 mm)
安裝類型 Surface Mount Surface Mount (BGA)
介面 Parallel (DDR4) Parallel
Auto Self-Refresh Yes —
Data Mask Function Yes —
Dynamic On-Chip Termination (ODT) Yes —
Asynchronous Reset Yes —
ZQ Calibration Yes —
Write Leveling Yes —
CRC Function Yes —
Auto Precharge Yes —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
CAS 延遲 [DATA_NEEDED: CAS Latency] —
Refresh Rate [DATA_NEEDED: refresh period] [DATA_NEEDED: refresh rate]
組織 — 1G x 8
Clock Cycle Time — 19 ns class (-062E speed grade)
Temperature Grade — Automotive (AUT)
Access Time (CAS Latency class) — DDR4-3200 timing class (tAA per datasheet)
Bank Group Architecture — Yes (DDR4 bank groups)
Termination — On-Die Termination (ODT)
CA Parity — Supported (DDR4 command/address parity)
Packaging Option — Tape and Reel (TR / :R suffix)
工作溫度範圍 — [DATA_NEEDED: operating temperature range]

資料表與資源

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