H5ANAG6NCMR-XNI vs H5ANAG6NAMR-UHC 比較

詳細並排比較 H5ANAG6NCMR-XNI 由 SK hynix 與 H5ANAG6NAMR-UHC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

SK hynix
H5ANAG6NCMR-XNI H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI - DDR4 16Gb 3200Mbps DRAM | SK Hynix

H5ANAG6NCMR-XNI ✓ 啟用中
SK hynix
H5ANAG6NAMR-UHC H5ANAG6NAMR-UHC - 16Gb DDR4-2400 SDRAM x16 1.2V | SK hynix

H5ANAG6NAMR-UHC - 16Gb DDR4-2400 SDRAM x16 1.2V | SK hynix

H5ANAG6NAMR-UHC ✓ 啟用中

規格比較

參數 H5ANAG6NCMR-XNI H5ANAG6NAMR-UHC
品牌 SK hynix SK hynix
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
記憶體類型 DDR4 SDRAM (volatile DRAM) DDR4 SDRAM
記憶體容量 16 Gb —
Memory Organization 1G x 16 —
資料速率 3200 Mbps (DDR4-3200, XN speed bin) —
供應電壓 1.2 V —
Technology CMOS Double Data Rate IV Synchronous DRAM —
Power Class Normal Power Normal Power
封裝 FBGA-96 FBGA-96 (PBGA96)
安裝類型 Surface Mount Surface Mount (BGA solder ball)
介面 Parallel (DDR4) —
Product Status Active —
Application Domain Main memory, industrial controllers, computing modules, consumer electronics —
Memory Format DRAM —
Speed Bin Family UH/VK/WM/XN —
工作溫度 [DATA_NEEDED: Operating Temperature] [DATA_NEEDED: operating temperature range]
VPP Supply Voltage [DATA_NEEDED: VPP Supply Voltage] —
MSL 等級 [DATA_NEEDED: MSL Level] —
Memory Density — 16 Gbit (2 GB)
組織 — 1G x 16
Speed Grade / Data Rate — DDR4-2400 (UHC bin, PC4-19200)
Supply Voltage (VDD) — 1.2 V
Architecture — CMOS DDR4 with bank groups
Refresh — Self-refresh and auto-refresh (DDR4 standard 64 ms)
CAS 延遲 — [DATA_NEEDED: CL for UHC bin]
介面類型 — Parallel, synchronous, double data rate
Available Speed Bins (family) — PB / RD / TF / UH / VK
Application Class — Main memory, embedded, industrial
RoHS 狀態 — [DATA_NEEDED: RoHS status]
生命週期狀態 — Active production

資料表與資源

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