K3LK2K20CM-JFCP vs K3LK4K40CM-BGCP 比較
詳細並排比較 K3LK2K20CM-JFCP 由 Samsung Electronics 與 K3LK4K40CM-BGCP 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K3LK2K20CM-JFCP | K3LK4K40CM-BGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | LPDDR5 SDRAM | LPDDR5 SDRAM |
| Density | 48 Gbit (6 GB) | 96 Gb (12 GB) |
| Speed Grade | LPDDR5-5500 | — |
| Max Pin Speed (LPDDR5 family) | 6400 Mbps | — |
| 封裝 | 441-ball FBGA | 496-ball FBGA |
| 組織 | [DATA_NEEDED: organization] | 1536M x 64 |
| Supply Voltage VDD | [DATA_NEEDED: VDD voltage] | — |
| Supply Voltage VDDQ | [DATA_NEEDED: VDDQ voltage] | — |
| 介面 | LPDDR5 (JEDEC low-power DRAM) | LPDDR5 (JEDEC) |
| Aggregate Transfer Rate (family max) | 51.2 Gb/s | — |
| Power Saving vs LPDDR4X | up to 20% | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| 工作溫度 | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature] |
| Place of Origin (distributor listing) | Johor, Malaysia | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| MSL 等級 | [DATA_NEEDED: moisture sensitivity level] | — |
| Application Domain | Mobile / Edge AI / Automotive memory | — |
| 資料速率 | — | 6400 Mbps per pin |
| Supply Voltage (VDD) | — | 1.05 V |
| Access Time / CAS Latency | — | [DATA_NEEDED: CAS Latency] |
| Refresh Scheme | — | Per-bank / all-bank refresh |
| Power-Down Modes | — | Deep sleep / power-down supported |
| Application Segment | — | Mobile, embedded, computing modules |
| Packaging | — | [DATA_NEEDED: standard packing quantity] |