K4A4G085WD-BCRC vs MT40A512M8RH-075E:B 比較

詳細並排比較 K4A4G085WD-BCRC 由 Samsung Electronics 與 MT40A512M8RH-075E:B 由 Micron Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Samsung Electronics
K4A4G085WD-BCRC K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC - 4Gb DDR4-2400 SDRAM 512Mx8 | Samsung

K4A4G085WD-BCRC ✓ 啟用中
Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 啟用中

規格比較

參數 K4A4G085WD-BCRC MT40A512M8RH-075E:B
品牌 Samsung Electronics Micron Technology
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 啟用中
Memory Density 4 Gbit —
組織 512M x 8 512M x 8
記憶體類型 DDR4 SDRAM (D-die) DDR4 SDRAM
資料速率 2400 Mb/s (PC2400) 2666 MT/s (DDR4-2666)
供應電壓 1.2 V —
封裝 FBGA-78 (TFBGA) 78-FBGA (9 x 10.5 mm), TFBGA
Number of Terminals 78 —
介面 Parallel —
Access Mode Multi-bank page burst —
安裝類型 Surface Mount Surface Mount
CAS 延遲 [DATA_NEEDED: CAS Latency] —
工作溫度範圍 [DATA_NEEDED: Operating Temperature Range] —
Refresh [DATA_NEEDED: Refresh specification] Refresh max interval extension at extended TC temperature range (125C capable per family features)
RoHS 狀態 [DATA_NEEDED: RoHS Status] [DATA_NEEDED: RoHS status]
MSL 等級 [DATA_NEEDED: MSL Level] —
Density — 4 Gbit
Clock Frequency — 1333 MHz (1.33 GHz)
VDD Supply Voltage — 1.2 V +/-60 mV
VDDQ Supply Voltage — 1.2 V +/-60 mV
VPP Supply Voltage — 2.5 V, -125 mV/+250 mV
介面類型 — Parallel
I/O Structure — 1.2V pseudo open-drain
參考電壓 — On-die internal adjustable VREFDQ generation
工作溫度 — [DATA_NEEDED: operating temperature range (standard grade)]
Speed Grade Suffix — -075E
Packaging Option Suffix — :B (ball map B designation per Mouser listing)

資料表與資源

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