K4A4G165WF-BCRC vs K4A4G165WD-BCPB 比較
詳細並排比較 K4A4G165WF-BCRC 由 Samsung Electronics 與 K4A4G165WD-BCPB 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A4G165WF-BCRC - 4Gb DDR4-2400 SDRAM | Samsung Electronics
K4A4G165WF-BCRC ✓ 啟用中
規格比較
| 參數 | K4A4G165WF-BCRC | K4A4G165WD-BCPB |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | DRAM | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 單價 (USD) | $17.08 | — |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| 組織 | 256M x 16 | 256M x 16 |
| Speed Grade | DDR4-2400 | — |
| 供應電壓 | 1.2 V | — |
| Operating Voltage Range | 1.14 V to 1.26 V | — |
| 封裝 | FBGA-96 (TFBGA) | FBGA-96 |
| Die Type | Samsung 4Gb F-die | — |
| Bank / Bank Group Architecture | 8 banks, bank groups | — |
| Data Mask | Supported (DM) | — |
| CRC / CA Parity | Supported | — |
| ZQ Calibration | Supported | — |
| Dynamic ODT | Supported | — |
| Auto Precharge | Supported | — |
| Asynchronous Reset | Supported | — |
| 工作溫度 | 0C to +95C | [DATA_NEEDED: operating temperature range] |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | Compliant | Compliant (lead-free suffix) |
| 資料速率 | — | 2133 MT/s |
| Core Voltage | — | 1.2 V |
| Die Generation | — | D-die |
| Bank Architecture | — | 4 bank groups x 4 banks |
| CAS 延遲 | — | [DATA_NEEDED: CAS Latency at 2133 speed bin] |
| Burst Length | — | 8 (BL8, fixed/chop) |
| 介面 | — | DDR4 (synchronous, source-synchronous strobe) |
| Pb-Free | — | Yes (per Samsung part-numbering suffix) |
| Refresh | — | Self-refresh supported (TCSR per DDR4 standard features) |