K4A8G085WC vs H5AN8G6NAFR-UHC 比較
詳細並排比較 K4A8G085WC 由 Samsung Electronics 與 H5AN8G6NAFR-UHC 由 SK hynix. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Samsung Electronics
K4A8G085WC - 8Gb DDR4 SDRAM 1Gx8 2666Mbps | Samsung Electronics
K4A8G085WC ✓ 啟用中
規格比較
| 參數 | K4A8G085WC | H5AN8G6NAFR-UHC |
|---|---|---|
| 品牌 | Samsung Electronics | SK hynix |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM (CMOS) |
| Density | 8 Gbit | — |
| 組織 | 1G x 8 | 512M x 16 |
| Speed | 2666 Mbps/pin (DDR4-2666) | — |
| 供應電壓 | 1.2 V | 1.2 V |
| Supply Voltage Range | 1.14 V to 1.26 V | — |
| Clock Frequency | 1333 MHz (1333.333 GHz nominal, per web data) | — |
| Operating Temperature (K4A8G085WC-BITD) | -40 C to +95 C | — |
| Operating Temperature (K4A8G085WC-BCTD) | 0 C to +95 C | — |
| 封裝 | 78-ball FBGA (78FBGA) | 96-ball FBGA (TFBGA) |
| 安裝類型 | Surface Mount | Surface Mount |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| Data Mask (DM) | Yes | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Memory Density | — | 8 Gbit |
| 資料速率 | — | 2400 MT/s |
| Clock Architecture | — | Differential clock (CK_t / CK_c), fully synchronous |
| 工作溫度 | — | 0C to +85C |
| Refresh | — | Auto self-refresh |
| Precharge | — | Auto precharge function |
| Reset | — | Asynchronous reset function |
| Data Mask | — | DM function supported |
| Termination | — | Dynamic on-chip termination (ODT) |
| Calibration | — | ZQ calibration function |
| Error Checking | — | CRC function |
| Write Leveling | — | Write leveling function supported |