K4AAG085WA-BCTD vs K4AAG085WM-BCWE 比較
詳細並排比較 K4AAG085WA-BCTD 由 Samsung Electronics 與 K4AAG085WM-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG085WA-BCTD | K4AAG085WM-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | DRAM |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit (2 GB) | 16 Gb |
| 組織 | 2G x 8 | 2G x 8 |
| 資料速率 | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| 供應電壓 | 1.2 V | 1.2 V |
| 封裝 | 78-ball FBGA (78FBGA) | 78FBGA |
| 工作溫度 | 0C to +85C | 0C to +85C |
| Speed Grade | DDR4-2666 (-BCTD) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 介面 | DDR4 parallel, JEDEC DDR4 ballout | DDR4 (JEDEC-standard) |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| Bank Architecture | 16 banks in 4 bank groups (DDR4 standard) | — |
| Burst Length | BL8 (DDR4 standard) | — |
| Application Domain | Computing, networking, industrial memory | — |
| Manufacturing Standard | JEDEC DDR4 SDRAM | — |
| Lead Time / Stock | [DATA_NEEDED: current stock status] | — |
| Bank Group Architecture | — | Yes (DDR4) |
| Speed Grade Suffix | — | -BCWE |
| Application Class | — | Memory IC / Storage Component |
| Power Reduction vs DDR3 | — | Approx. 25% lower (per Samsung DDR4 literature) |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |