K4AAG165WM-BCRC vs K4AAG165WA-BCWE 比較
詳細並排比較 K4AAG165WM-BCRC 由 Samsung Electronics 與 K4AAG165WA-BCWE 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K4AAG165WM-BCRC | K4AAG165WA-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gb | — |
| 組織 | 1G x 16 | — |
| 資料速率 | 3200 Mbps | 3200 Mbps (DDR4-3200) |
| Supply Voltage (VDD) | 1.2 V | — |
| 介面 | DDR4 (SSTL-12) | — |
| 封裝 | 96-ball FBGA | 96-ball FBGA |
| 安裝類型 | Surface Mount | Surface Mount |
| Auto Precharge | Yes | — |
| Asynchronous Reset | Yes | — |
| CRC Function | Yes | — |
| ZQ Calibration | Yes | — |
| Dynamic On-Chip Termination | Yes | — |
| Data Mask Function | Yes | — |
| 工作溫度 | [DATA_NEEDED: operating temperature range for K4AAG165WM-BCRC] | -40C to +95C |
| CAS Latency (CL) | [DATA_NEEDED: CAS latency at 3200 Mbps] | — |
| RoHS 狀態 | Compliant | Compliant |
| 記憶體容量 | — | 16 Gb (2 GB) |
| Memory Organization | — | 1G x 16 |
| 供應電壓 | — | 1.2 V |
| Package Dimensions | — | 13 x 9 mm |
| Ball Pitch | — | 0.8 mm |
| 介面類型 | — | Parallel, DDR4 |
| Memory Format | — | DRAM (Volatile) |
| Technology | — | DDR4 SDRAM, 8n prefetch, bank group architecture |
| Packaging | — | Tray |
| Product Status | — | Active |