K9ADGD8S0A vs K9HQGY8S5M 比較
詳細並排比較 K9ADGD8S0A 由 Samsung Electronics 與 K9HQGY8S5M 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | K9ADGD8S0A | K9HQGY8S5M |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 類別 | EEPROM | Memory ICs |
| 生命週期狀態 | 停產終止 | 啟用中 |
| Device Type | 3D V-NAND flash memory bare die | — |
| Process Technology | Terabit Cell Array Transistor (TCAT) | — |
| Architecture | 3D vertical NAND (V-NAND) | — |
| Form Factor | Bare die (unpackaged) | — |
| Found In | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages | — |
| Known Application | Samsung 850 Pro 128 GB SSD | — |
| Memory Class | Non-volatile NAND flash | Non-volatile NAND flash |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Documented By | TechInsights report SAR-1407-802 | — |
| Capacity | [DATA_NEEDED: die capacity] | — |
| 供應電壓 | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: VCC range] |
| 介面 | [DATA_NEEDED: interface type] | NAND (ONFI/Toggle-style asynchronous interface) - exact timing mode [DATA_NEEDED: interface timing mode] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Program/Erase Cycles | [DATA_NEEDED: endurance] | [DATA_NEEDED: P/E endurance rating] |
| 工作溫度 | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature range] |
| 封裝 | [DATA_NEEDED: package] | — |
| Product Type | — | 3D V-NAND Flash Memory (stacked, client NAND) |
| Package Type | — | 316-ball Fine Pitch BGA (FBGA-316) |
| Die Configuration | — | 4 x K9ADGD8S0A V-NAND dies (per TechInsights package analysis) |
| NAND Technology | — | 32-layer pMLC 3D V-NAND (per Samsung 850 Pro 256 GB analysis) |
| Density | — | [DATA_NEEDED: total bit density] |
| Block Size | — | [DATA_NEEDED: block size] |
| 安裝類型 | — | Surface Mount (BGA) |
| RoHS 狀態 | — | [DATA_NEEDED: RoHS status] |
| MSL 等級 | — | [DATA_NEEDED: moisture sensitivity level] |
| Original Application | — | Samsung SSD 850 Pro solid-state drive |