MC9S08DV128CLH vs MC9S08DN60ACLH 比較

詳細並排比較 MC9S08DV128CLH 由 NXP Semiconductors 與 MC9S08DN60ACLH 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08DV128CLH MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH - 8-Bit 40MHz HCS08 MCU 128KB Flash 64-LQFP | NXP

MC9S08DV128CLH ✓ 啟用中
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

規格比較

參數 MC9S08DV128CLH MC9S08DN60ACLH
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Architecture HCS08 (enhanced S08 core) —
資料匯流排寬度 8-bit 8 bit
CPU Frequency 40 MHz 40 MHz
Internal Bus Frequency 20 MHz —
Program Memory Size 128 KB (128K x 8) Flash —
RAM Size 6 KB (6K x 8) 2 KB (2K x 8)
Number of I/O Pins 53 —
封裝 64-LQFP (10x10 mm) —
安裝類型 Surface Mount Surface Mount
Oscillator Type External External
工作電源電壓 [DATA_NEEDED: Vdd range] —
工作溫度範圍 [DATA_NEEDED: temperature grade] —
Instruction Set HC08 with BGND addition HC08 + BGND instruction
Interrupt Sources Up to 32 Up to 32
Integrated CAN Module Yes (CAN 2.0) —
Packaging Tray Tray
RoHS 狀態 Compliant Compliant
Core — HCS08 (S08 core)
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Number of I/O — 53
封裝 / 外殼 — 64-LQFP (10x10 mm)
ADC — 16-channel, 12-bit, 2.5 us conversion
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
工作溫度 — -40C to +85C [DATA_NEEDED: confirm automotive grade range]
On-Chip Debug — BDM (Background Debug Mode)

資料表與資源

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