MC9S08QD4VPC vs MC9S08QD4MPC 比較

詳細並排比較 MC9S08QD4VPC 由 NXP Semiconductors 與 MC9S08QD4MPC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MC9S08QD4VPC MC9S08QD4VPC - 8-bit S08 MCU, 4KB Flash, 16MHz, DIP-8 | NXP

MC9S08QD4VPC - 8-bit S08 MCU, 4KB Flash, 16MHz, DIP-8 | NXP

MC9S08QD4VPC ✓ 啟用中
NXP Semiconductors
MC9S08QD4MPC MC9S08QD4MPC - 8-bit HCS08 MCU, 4KB Flash, DIP-8 | NXP

MC9S08QD4MPC - 8-bit HCS08 MCU, 4KB Flash, DIP-8 | NXP

MC9S08QD4MPC ✓ 啟用中

規格比較

參數 MC9S08QD4VPC MC9S08QD4MPC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Core S08 (HCS08) 8-bit CPU HCS08 (enhanced 8-bit)
Instruction Set HC08 with added BGND HC08 with BGND
Maximum CPU Frequency 16 MHz (8 MHz bus) 16 MHz (8 MHz bus)
Program Memory (Flash) 4 KB (4K x 8) 4 KB
RAM 256 bytes 256 bytes
Supply Voltage Range 2.7 V to 5.5 V —
封裝 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm)
GPIO Pins 6 —
ADC 4-channel, 10-bit 4-channel, 10-bit
Timers MTIM and TPM (per datasheet) —
Communication Interfaces SCI (UART), I2C multimaster —
Debug Interface Background Debug Mode (BDM), 3 breakpoints Background Debug Mode (BDM), single breakpoint + 2 on-chip breakpoints
工作溫度 -40 C to +85 C (industrial, typical) —
安裝類型 Through-hole (DIP) Through-Hole
RoHS 狀態 [DATA_NEEDED: RoHS status from datasheet] Compliant
MSL 等級 [DATA_NEEDED: MSL level for DIP-8] —
General-Purpose I/O Pins — 6
Clock Source — Internal oscillator, external crystal/resonator support
Family — S08QD (lowest-end S08 8-bit family)
Architecture — CISC
Lead-Free — Yes

資料表與資源

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