MC9S12DT256MPVE vs MC9S12DT256MFUE 比較
詳細並排比較 MC9S12DT256MPVE 由 NXP Semiconductors 與 MC9S12DT256MFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndNXP Semiconductors
MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP
MC9S12DT256MFUE ✓ 啟用中規格比較
| 參數 | MC9S12DT256MPVE | MC9S12DT256MFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 啟用中 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | [DATA_NEEDED: RAM size] |
| EEPROM | 4 KB | [DATA_NEEDED: EEPROM size] |
| 資料匯流排寬度 | 16-bit | 16-bit |
| 供應電壓 | 2.35 V to 2.75 V (regulated core) | — |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 16-channel, 10-bit (per family) |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | — |
| 封裝 | 112-LQFP (20x20 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount |
| 工作溫度 | -40C to +125C (automotive grade) | — |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 狀態 | Compliant | [DATA_NEEDED: RoHS status] |
| 生命週期狀態 | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS12 (CPU12), 16-bit CISC |
| Flash Memory | — | 256 KB (256K x 8) |
| Operating Supply Voltage (Core) | — | 2.35 V to 2.75 V |
| I/O Supply Voltage | — | 5V-tolerant I/O on VDDR/VSSR |
| Number of I/O Pins | — | 91 |
| Package Type | — | 80-QFP (PQFP/LQFP-80, 14x14 mm) |
| Terminal Form | — | GULL WING |
| Number of Terminals | — | 80 |
| Temperature Grade | — | Automotive |
| MSL 等級 | — | [DATA_NEEDED: MSL level] |
| On-chip CAN Module | — | MSCAN (CAN 2.0A/B) |
| PWM Module | — | 8-channel 16-bit PWM |
| Communication Peripherals | — | SCI, SPI, IIC, BDLC |