MCF5307CAI66B vs MCF5307FT66B 比較

詳細並排比較 MCF5307CAI66B 由 NXP Semiconductors 與 MCF5307FT66B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MCF5307CAI66B MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B ⚠ 最後購買機會
NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd

規格比較

參數 MCF5307CAI66B MCF5307FT66B
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 NRND
Core ColdFire V3 —
資料匯流排寬度 32 bit 32-bit
最大時脈頻率 66 MHz 66 MHz
Performance 70 MIPS —
Instruction Set Architecture ColdFire (variable-length RISC, 68k-derived) —
On-chip SRAM 4 KB 4 KB (4K x 8)
On-chip ROM ROMless —
供應電壓 3.3 V [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet]
工作溫度 -40C to +85C [DATA_NEEDED: temperature grade per device marking]
封裝 208-FQFP (28x28 mm) —
安裝類型 Surface Mount Surface Mount
MAC Unit Yes (integrated multiply-accumulate) —
DRAM Controller Yes (integrated) —
DMA Controller Yes —
UART 2 —
Process Node 0.35 um —
Tray Quantity Per manufacturer tray standard —
RoHS 狀態 Compliant [DATA_NEEDED: per device marking]
Core Architecture — ColdFire V3 (MCF530x)
Program Memory Type — ROMless (external memory required)
Number of I/O Lines — 16
Oscillator Type — External
封裝 / 外殼 — 208-BFQFP (28x28 mm)
External Memory Controller — Yes (ROM/SRAM/DRAM/Flash)
DMA Channels — [DATA_NEEDED: DMA channel count]
Timers — [DATA_NEEDED: timer module count]
Serial Interfaces — [DATA_NEEDED: UART/SPI/I2C instance count]
Packaging (distributor) — Tray

資料表與資源

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