MCIMX233CJM4C vs MCIMX233DJM4B 比較
詳細並排比較 MCIMX233CJM4C 由 NXP Semiconductors 與 MCIMX233DJM4B 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors
MCIMX233DJM4B ⚠ 最後購買機會規格比較
| 參數 | MCIMX233CJM4C | MCIMX233DJM4B |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 停產終止 | 最後購買 |
| Core Architecture | ARM926EJ-S (ARMv5TEJ) | ARM926EJ-S |
| Number of Cores | 1 | — |
| 資料匯流排寬度 | 32-bit | 32-bit |
| Maximum CPU Clock | 454 MHz | 454 MHz |
| Instruction Cache (I-Cache) | 16 KB | — |
| Data Cache (D-Cache) | 16 KB | — |
| Internal SRAM | 32 KB | — |
| ROM (Bootloader) | 64 KB | — |
| Program Memory Size | 64 KB (16K x 32) | — |
| RAM Size | 32 KB (8K x 32) | — |
| Number of I/O | 95 | — |
| 工作溫度範圍 | -40C to +85C (Industrial) | -40 C to +85 C (commercial grade) |
| Oscillator Type | External | — |
| 封裝 / 外殼 | 169-MAPBGA (11x11 mm) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Process Technology | 90 nm CMOS | — |
| RoHS 狀態 | Compliant | — |
| Core Count | — | 1 |
| Instruction Cache | — | 16 KB |
| Data Cache | — | 16 KB |
| 封裝 | — | 169-MAPBGA (11x11 mm) |
| Ball Pitch | — | 0.65 mm |
| USB | — | USB HS Device/Host with integrated PHY |
| UART | — | 3 |
| SSP (SPI) | — | 2 |
| I2C | — | 1 master |
| Serial Audio Interface (SAI) | — | 2 |
| SPDIF | — | 1 (transceiver) |
| Low-Resolution ADC | — | 6 channels, 12-bit |
| LCD Controller | — | Yes (digital TFT panels) |
| Integrated PMU | — | Yes (linear LDOs + DCDC control) |
| Mixed-Signal Audio / Headphone Amplifier | — | Yes (integrated) |
| 供應電壓 | — | Single 3.6 V to 4.5 V (Li-Ion cell) |