MPC8260ACZUMIBB vs XPC8260CVVIFBC 比較

詳細並排比較 MPC8260ACZUMIBB 由 NXP Semiconductors 與 XPC8260CVVIFBC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8260ACZUMIBB MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP

MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP

MPC8260ACZUMIBB Obsolete
NXP Semiconductors
XPC8260CVVIFBC XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom

XPC8260CVVIFBC - 200MHz PowerQUICC II G2 MPU | NXP | Network/Telecom

XPC8260CVVIFBC ✓ 啟用中

規格比較

參數 MPC8260ACZUMIBB XPC8260CVVIFBC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 Obsolete 啟用中
Core Processor PowerPC G2 —
Architecture RISC 32-bit —
Number of Cores 1 —
Core Clock Speed 266 MHz —
Co-Processor / DSP Communications; RISC CPM —
RAM Controllers DRAM, SDRAM —
Graphics Acceleration No —
Display & Interface Controllers None (per datasheet) —
Supply Voltage - Core 1.8 V —
Supply Voltage - I/O 3.3 V —
Process Technology 0.25 µm CMOS —
封裝 480-TBGA (37.5 x 37.5 mm) —
安裝類型 Surface Mount Surface Mount (BGA)
工作溫度 [DATA_NEEDED: full operating temperature range] —
Part Status Not For New Designs (No Longer Manufactured) —
Processor Type — PowerPC G2 Microprocessor IC MPC82xx (PowerQUICC II)
Core Architecture — PowerPC G2, 1 Core, 32-Bit
CPU Clock Speed — 200 MHz
Core Supply Voltage — 2.5 V
Communications Processor Module (CPM) — Integrated (per PowerQUICC II architecture)
封裝 / 外殼 — 480-LBGA (TBGA), 37.5 x 37.5 mm
Terminal Form — Ball
Number of Terminals — 480
Package Body Material — Plastic / Epoxy
Packaging — Tray
Manufacturer Lifecycle Source — NXP Semiconductors (Freescale/Motorola legacy)
RoHS 狀態 — [DATA_NEEDED: RoHS compliance]
Lead Free — [DATA_NEEDED: lead-free status]
Series — PowerQUICC II (PQ II HIP 3)

資料表與資源

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