MPC8265AVVPIBC vs MPC8250AVVPIBC 比較
詳細並排比較 MPC8265AVVPIBC 由 NXP Semiconductors 與 MPC8250AVVPIBC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC8265AVVPIBC | MPC8250AVVPIBC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 最後購買 |
| Manufacturer | NXP USA Inc. | — |
| Series | MPC82xx | MPC82xx (PowerQUICC II) |
| Core Processor | PowerPC G2 | — |
| Number of Cores | 1 | 1 |
| Bus Width | 32-Bit | — |
| Speed (Clock) | 300 MHz | — |
| Co-Processors / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | No | — |
| Ethernet | 10/100 Mbps (2x MAC) | — |
| USB | No | — |
| SATA | No | — |
| PCI | Yes (PCI bridge) | — |
| Operating Voltage | 3.3 V (core/IO); 2.0 V internal | — |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS |
| 工作溫度 | -40C to +85C (industrial) | 0C to +105C |
| 封裝 / 外殼 | 480-TBGA (37.5 x 37.5 mm) | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | Compliant | Non-Compliant (NO-PB marking) |
| Part Status | Not For New Designs (NRND) | — |
| Core Architecture | — | PowerPC G2 |
| 資料匯流排寬度 | — | 32-Bit |
| Core Frequency | — | 300 MHz |
| 供應電壓 | — | 3.3 V |
| 封裝 | — | 480-TBGA (37.5 x 37.5 mm) |
| 腳位數 | — | 480 |
| Communications Processor Module | — | Integrated CPM |
| External Bus Speed | — | Up to 133 MHz |
| Memory Controller | — | SDRAM / Flash / ROM |