MPC8313ZQADDC vs MPC8313VRAGDC 比較

詳細並排比較 MPC8313ZQADDC 由 NXP Semiconductors 與 MPC8313VRAGDC 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8313ZQADDC MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC - PowerQUICC II Pro 266MHz MPU 516-TEPBGA | NXP

MPC8313ZQADDC ✓ 啟用中
NXP Semiconductors
MPC8313VRAGDC MPC8313VRAGDC - PowerQUICC II Pro MPU 400MHz | NXP

MPC8313VRAGDC - PowerQUICC II Pro MPU 400MHz | NXP

MPC8313VRAGDC ✓ 啟用中

規格比較

參數 MPC8313ZQADDC MPC8313VRAGDC
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 啟用中
Manufacturer NXP Semiconductors / Freescale —
Series MPC83xx PowerQUICC II Pro —
Core Architecture PowerPC e300c3 e300c3 (32-bit Power Architecture)
Core Count 1 —
資料匯流排寬度 32-bit —
Max Core Frequency 267 MHz —
Process Technology 0.09 µm CMOS 0.09 um CMOS
Operating Voltage (Core) 1.8 V —
Operating Voltage (DDR I/O) 2.5 V / 1.8 V —
Operating Voltage (Standard I/O) 3.3 V —
工作溫度 0 °C to +105 °C 0 C to 105 C (commercial / extended)
Package Type 516-TEPBGA (27x27 mm) —
Ball Count 516 —
Integrated Memory Controller DDR1/DDR2 up to 266 MHz —
Integrated Ethernet 10/100/1000 Mbps (3x eTSEC) —
USB Interface USB 2.0 High-Speed (Host/Device) —
PCI Interface PCI 32-bit/66 MHz + mini-PCI —
Security Engine AES / DES / 3DES SEC 2.0 (DES, 3DES, AES, PKA)
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
MSL 等級 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL rating]
RoHS 狀態 [DATA_NEEDED: RoHS status] Compliant
CPU Frequency — 400 MHz
Instruction Set — Power Architecture, 32-bit RISC
L1 Cache — [DATA_NEEDED: cache size specifics]
Memory Controller — DDR1/DDR2, 16/32-bit, up to 333 MHz
Ethernet — Gigabit MAC with SGMII interface
USB — USB 2.0 High-Speed (480 Mbps)
PCI — PCI 2.3, 32-bit, up to 66 MHz
封裝 — 516-TEPBGA (27x27 mm) with exposed pad
供應電壓 — 1.0 V / 1.8 V / 2.5 V / 3.3 V
Silicon Revision — Rev 3
Terminal Count — 516 (BGA)

資料表與資源

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