MPC852TZT80A vs MPC852TVR80A 比較
詳細並排比較 MPC852TZT80A 由 NXP Semiconductors 與 MPC852TVR80A 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC852TZT80A | MPC852TVR80A |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | NRND | 最後購買 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC, MPC8xx | — |
| Core | MPC8xx (32-bit Power Architecture) | Power Architecture, 32-bit, 1 core |
| Core Count | 1 | — |
| Core Frequency | 80 MHz | 80 MHz |
| Process Technology | 0.18 µm CMOS | — |
| 供應電壓 | 3.3 V | 3.3 V core with 5 V-tolerant I/O option |
| 工作溫度 | 0 °C to +95 °C | 0 °C to +95 °C |
| Package Type | 256-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 23 x 23 mm | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| Tray Packaging | Tray (per distributor listing) | — |
| Product Category | Microprocessors (MPU) | — |
| RoHS 狀態 | Non-Compliant (legacy part) | Details not published - verify per lot |
| Lead Finish | Contains lead (SnPb or lead-bearing solder profile) | — |
| Series / Family | — | MPC8xx / PowerQUICC I |
| 封裝 | — | 256-PBGA (23x23 mm, 1.27 mm pitch) |
| Instruction/Data Cache | — | 8 KB unified |
| Communications Module | — | CPM (Communications Processor Module) with HDLC/Ethernet |
| Ethernet Support | — | Up to 3x Fast Ethernet (10/100) |
| PCI Bridge | — | Integrated PCI bridge |
| MSL 等級 | — | 3 (168 hours) |
| HTSUS Code | — | 8542.31.0001 |