MPC8541ECPXALF vs MPC8541EPXALF 比較

詳細並排比較 MPC8541ECPXALF 由 NXP Semiconductors 與 MPC8541EPXALF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ 啟用中
NXP Semiconductors
MPC8541EPXALF MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP

MPC8541EPXALF ⚠ 最後購買機會

規格比較

參數 MPC8541ECPXALF MPC8541EPXALF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 最後購買
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500, 32-bit
Maximum Core Frequency 667 MHz —
資料匯流排寬度 64-bit 64-bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB unified with ECC
Core Supply Voltage 1.2 V (typical) —
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) 3 x eTSEC (10/100/1000 Mbps)
Memory Controller DDR/DDR2 with ECC 64-bit DDR/DDR2 with ECC
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) SEC 2.0 (DES/3DES/AES/SHA)
封裝 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) —
工作溫度 -40C to +105C 0C to +105C
安裝類型 Surface Mount Surface Mount (Flip-Chip BGA)
RoHS Compliance Compliant (lead-free) —
Manufacturer — NXP Semiconductors (formerly Freescale)
Series — PowerQUICC III (MPC85xx)
Core Frequency — 667 MHz
供應電壓 — 1.2 V (core); 2.5 V / 3.3 V (I/O)
Package Type — FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip)
腳位數 — 783
L1 Cache — 32 KB instruction + 32 KB data
RoHS 狀態 — Compliant
Lead Free — Yes

資料表與資源

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