MPC8555EPXAPF vs MPC8555VTAPF 比較

詳細並排比較 MPC8555EPXAPF 由 NXP Semiconductors 與 MPC8555VTAPF 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC8555EPXAPF MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP

MPC8555EPXAPF - PowerQUICC III 833MHz e500 MPU | NXP

MPC8555EPXAPF ⚠ 最後購買機會
NXP Semiconductors
MPC8555VTAPF MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF - 833MHz PowerQUICC III MPU | NXP | 783-FCPBGA

MPC8555VTAPF ✗ 停產

規格比較

參數 MPC8555EPXAPF MPC8555VTAPF
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 最後購買 停產終止
Architecture PowerPC e500 (Power Architecture) —
Core Single e500 —
資料匯流排寬度 32-Bit —
Maximum Clock Speed 833 MHz —
Core Supply Voltage 1.2 V —
I/O Supply Voltage 2.5 V / 3.3 V —
Package Type FCPBGA-783 (29 x 29 mm, 1 mm pitch, flip chip) —
Package Height 3.75 mm —
腳位數 783 —
工作溫度範圍 -40 °C to +85 °C (industrial, extended) —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Memory Controller DDR / DDR2 up to 333 MHz —
Ethernet Two 10/100 Fast Ethernet MACs Dual 10/100/1000 MAC with TCP/IP acceleration
PCI Interface PCI / PCI-X bridge (up to 133 MHz) —
Process Technology 130 nm CMOS —
RoHS 狀態 [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance status]
Security Engine SEC 2.0 (Integrated) IPSec / SSL / TLS / 3DES / AES acceleration
Core Processor — PowerPC e500
Number of Cores — 1 Core, 32-Bit
Maximum Core Frequency — 833 MHz
Co-Processor / DSP — Communications; CPM (Communications Processor Module)
Memory Controllers — DDR, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — Yes (per datasheet)
PCI / PCI-X Interfaces — Dual PCI/PCI-X
Local Bus Controller — Yes
L1 Cache — 32 KB Instruction + 32 KB Data
工作溫度 — -40C to +105C (Industrial / Extended)
封裝 — 783-FCPBGA, 29x29 mm
安裝類型 — Surface Mount (BGA)
Part Status — Not For New Designs

資料表與資源

瀏覽所有產品 建立 BOM 索取報價