MPC860DTVR66D4 vs MPC860PZQ66D4 比較

詳細並排比較 MPC860DTVR66D4 由 NXP Semiconductors 與 MPC860PZQ66D4 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPC860DTVR66D4 MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP

MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP

MPC860DTVR66D4 Nrnd
NXP Semiconductors
MPC860PZQ66D4 MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP

MPC860PZQ66D4 ✗ 停產

規格比較

參數 MPC860DTVR66D4 MPC860PZQ66D4
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 NRND 停產終止
Core Architecture PowerPC (MPC8xx) 32-bit PowerPC
Core Count 1 1
資料匯流排寬度 32-bit —
Max Core Frequency 66 MHz —
工作電源電壓 3.3 V 3.3 V
Series MPC8xx / PowerQUICC PowerQUICC
封裝 / 外殼 357-BGA (PBGA, 25x25 mm) —
安裝類型 Surface Mount Surface Mount
工作溫度 0 C to +95 C -40C to +95C (industrial, per D4 revision)
Packaging Tray Tray
On-chip Peripherals CPM, ENET, ATM, HDLC, PCMCIA —
Ethernet 10 Mbps x2 —
Graphics Acceleration No —
Lead Free Status Lead Free —
RoHS 狀態 RoHS Compliant Non-Compliant (Contains Lead)
Part Status Not For New Designs —
Processor Family — PowerQUICC MPC8xx
Maximum CPU Clock — 66 MHz
封裝 — 357-PBGA (25x25 mm)
Lead Status — Contains Lead (non-RoHS)
On-chip Communications Module — CPM with SCCs, SMCs, Ethernet, HDLC
Memory Controller — DRAM, SRAM, Flash, EPROM
Timers — 4 x 16-bit
Process Technology — 0.32 um CMOS
MSL 等級 — 3

資料表與資源

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