MPC860DTVR66D4 - PowerQUICC MPU 66MHz 357-PBGA | NXP
MPN： MPC860DTVR66D4 ✗ 停產MPC860DTVR66D4 概覽
A PowerQUICC microprocessor belongs to the MPU (microprocessor unit) class of integrated circuits, historically positioned as a communications-centric system-on-chip that merges a PowerPC processor core with dedicated serial-protocol engines. In the system hierarchy, it sits above general-purpose microcontrollers, offering higher deterministic I/O bandwidth for telecom and networking equipment where offloading protocol framing from the CPU is essential.
Key features include the integrated CPM with RISC communication engines, dual 10 Mbps Ethernet MACs, ATM and HDLC support, PCMCIA controller, DRAM controller with bus sizing logic, and the standard PowerPC memory management unit. The 66 MHz core clock drives both the CPU and the CPM, while the external bus supports 32-bit data paths at up to 66 MHz. The 3.3 V supply rail and 0 to 95 C operating temperature make it suitable for industrial embedded systems.
Typical applications include telecom switching fabric, ISDN terminal adapters, ATM/Frame Relay access devices, industrial routers, and legacy networking equipment. The combination of CPU + CPM is especially valuable where deterministic serial-channel handling must coexist with higher-layer protocol stacks without external ASICs.
When designing with this device, note that the 357-PBGA package requires multi-layer PCB design with controlled-impedance routing for the external bus; verified JTAG and BDM debug tools must be used for development. The part is Not For New Designs per distributor listings, so consider migration to MPC860SAR or newer PowerQUICC II/III variants for new projects.
This page synthesizes distributor pricing, drop-in alternatives within the MPC860 family, and practical design notes not found in the manufacturer datasheet alone.
直接替換替代品，適用於 MPC860DTVR66D4 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： MPC860DTVR66D4 （相同外形與佔位） — 差異在於 Operating Temperature, Core Architecture, RoHS Status, Category, Data Bus Width.
MPC860DTVR80D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860PVR80D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860PZQ66D4
✅ 直接替換聯絡詢價
查看資料表 →MPC860TZQ66D4
✅ 直接替換聯絡詢價
查看資料表 →MPC855TCVR66D4
✅ 直接替換📋 參考替代品（不在目錄中）
MPC857TCVR66B
✅ 直接替換📋 參考替代品（不在目錄中）
MPC860DTVR66D4 最大額定值與電氣特性
| Core Architecture | PowerPC (MPC8xx) |
| Core Count | 1 |
| 資料匯流排寬度 | 32-bit |
| Max Core Frequency | 66 MHz |
| 工作電源電壓 | 3.3 V |
| Series | MPC8xx / PowerQUICC |
| 封裝 / 外殼 | 357-BGA (PBGA, 25x25 mm) |
| 安裝類型 | Surface Mount |
| 工作溫度 | 0 C to +95 C |
| Packaging | Tray |
| On-chip Peripherals | CPM, ENET, ATM, HDLC, PCMCIA |
| Ethernet | 10 Mbps x2 |
| Graphics Acceleration | No |
| Lead Free Status | Lead Free |
| RoHS 狀態 | RoHS Compliant |
| Part Status | Not For New Designs |
MPC860DTVR66D4 357-bga (pbga, 25x25 mm) 腳位配置指南
MPC860DTVR66D4（357-bga (pbga, 25x25 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： MPC860DTVR66D4.
請參閱 資料表 以查看完整腳位配置。
典型應用
MPC860DTVR66D4 適用於 6 應用s: Telecom Switching Fabric, ISDN Terminal Adapter, ATM / Frame Access Access Concentrator, Industrial Router, Legacy Networking Equipment Service Replacement, Embedded Communications Controller.
Telecom Switching Fabric
The MPC860DTVR66D4 fits telecom switching fabric designs because its integrated Communications Processor Module (CPM) offloads HDLC and ATM framing from the PowerPC core, freeing the 32-bit CPU to run higher-layer signaling stacks. At 66 MHz the device handles multiple T1/E1 channels simultaneously with deterministic latency, which is essential for PBX and central-office equipment where call-setup jitter is unacceptable. The dual 10 Mbps Ethernet MACs provide LAN-side connectivity for management and signaling traffic without an external MAC ASIC, reducing BOM cost and board area. Compared with discrete CPU + framer solutions, the single-chip integration cuts PCB layer count and improves mean time between failure in 24/7 carrier deployments. Place the device on a six-layer board with the 357-PBGA mounted on via-in-pad land pattern for reliable thermal performance and controlled-impedance bus routing.
推薦
ISDN Terminal Adapter
The MPC860DTVR66D4 is a strong fit for ISDN terminal adapters because the CPM's HDLC engine natively handles the LAPD protocol used on the ISDN D-channel, while the 66 MHz PowerPC core runs the higher-layer state machines and user interface. Integrating both the BRI line-side and the Ethernet LAN-side into one SoC eliminates the external framer chip and reduces bill-of-materials cost in residential gateway designs. The PCMCIA controller supports legacy PC-card modems for fallback connectivity, a useful feature for ISDN routers sold into European markets in the early 2000s. At 3.3 V core supply and 0 to 95 C operating temperature, the device fits standard indoor SOHO enclosures without active cooling. Compared with general-purpose MCUs, the deterministic CPM interrupts guarantee channel latency within microseconds even under heavy CPU load.
推薦
ATM / Frame Access Access Concentrator
The MPC860DTVR66D4 is purpose-built for ATM and Frame Relay access concentrators because its CPM includes dedicated segmentation and reassembly (SAR) engines for ATM cells and HDLC controllers for Frame Egress, all running concurrently with the PowerPC core. At 66 MHz the device can sustain multiple DS1/E1 links aggregating into a single uplink without dropping cells under bursty traffic conditions. The integrated DRAM controller with bus-sizing logic interfaces directly to industry-standard SDRAM and FPGAs, simplifying the data-path design. The 357-PBGA package supports the high pin density required for parallel ATM UTOPIA-style interfaces plus Ethernet MACs, all within a single chip. Compared with merchant-silicon ATM chipsets, the PowerQUICC SoC approach gives OEMs full software control over queuing and congestion management.
推薦
Industrial Router
The MPC860DTVR66D4 is well suited to industrial routers because its dual 10 Mbps Ethernet MACs support redundant LAN uplinks while the CPM handles WAN serial protocols including HDLC, PPP, and Frame Relay, all without an external communications ASIC. At 66 MHz the PowerPC core comfortably runs routing stacks such as Linux or VxWorks with the CPM offloading the time-critical packet processing. The 0 to 95 C commercial operating temperature range covers most factory-floor enclosures, while the 3.3 V supply simplifies integration into 24 V industrial power systems with standard buck regulators. Compared with later PowerQUICC II devices, the MPC860 family remains a cost-effective choice for low-port-count industrial routers in legacy installations.
推薦
Legacy Networking Equipment Service Replacement
The MPC860DTVR66D4 is primarily needed today as a service-replacement part for long-life-cycle networking equipment still in the field, including carrier-grade routers, ATM switches, and industrial gateways deployed in the late 1990s and early 2000s. Because the part is NRND, replacement inventory is sourced from authorized distributors and franchised brokers like Rochester Electronics who hold qualified legacy stock. The 357-PBGA 25x25 mm footprint is consistent across the MPC860 family, so service boards can be reworked with the MPC860DTVR80D4 for additional clock headroom. Compared with full system replacement, swapping an identical-footprint PowerQUICC SoC preserves the chassis, backplane, and firmware qualification cycle, dramatically reducing field-service cost.
推薦
Embedded Communications Controller
The MPC860DTVR66D4 also fits embedded communications controller applications such as protocol converters, serial-to-Ethernet bridges, and SCADA front-ends where deterministic serial-channel timing is more important than raw CPU throughput. The CPM's multiple SCCs and SMCs provide flexible serial interfaces for RS-232, RS-485, and V.35 links, while the 66 MHz PowerPC core runs the protocol-conversion firmware and management stack. The integrated PCMCIA controller supports removable memory cards for firmware updates in field installations, a feature valued in unmanned remote sites. At 3.3 V and 0 to 95 C the part integrates into compact fanless enclosures common in factory automation cabinets. Compared with microcontroller-plus-external-framer designs, the single-chip approach reduces PCB area by roughly 40 percent.
推薦
推薦產品摘要
工程參考資料，適用於 MPC860DTVR66D4 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | MPC860DTVR80D4 | MPC860PVR80D4 | MPC860PZQ66D4 | MPC860TZQ66D4 | MPC855TCVR66D4 | MPC857TCVR66B |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Clock | 66 MHz | 80 MHz | 80 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Core Architecture | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx | PowerPC MPC8xx |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| On-chip Ethernet | 10 Mbps x2 | 10 Mbps x2 | 10 Mbps x1 | 10 Mbps x2 | 10 Mbps x1 | 10 Mbps x1 | 10 Mbps x1 |
| CPM / HDLC / ATM | Yes | Yes | Yes | Yes | Yes | Reduced | Reduced |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
主要差異化特點
- Full peripheral integration at lowest clock in family (對比MPC860DTVR80D4)
- Dual 10 Mbps Ethernet MACs (對比MPC860PVR80D4)
- ATM SAR engine integrated (對比MPC855TCVR66D4)
設計說明
The 357-PBGA 25x25 mm package requires a six-layer PCB with via-in-pad construction for reliable assembly. Place a continuous ground plane beneath the device to provide both a low-impedance return path for the high-speed external bus and thermal spreading for the 3.3 V core supply. Per the NXP MPC860 hardware specifications document, all BGA signal balls must be routed on inner layers with microvia fan-out, and the outer layers reserved for power and ground pour.
Estimated: at 3.3 V core supply and 66 MHz with typical CPM activity, the MPC860DTVR66D4 dissipates roughly 1.5 to 2.0 W depending on I/O switching activity. The 357-PBGA package provides adequate thermal performance in still air up to about 60 C ambient, but in enclosed chassis without airflow, attach a small heatsink or thermal pad to the top of the package to keep junction temperature below 95 C.
Route the 32-bit external memory bus with matched-length traces to within +/- 1 cm to preserve setup and hold margins at 66 MHz. Per the NXP datasheet, the SDRAM clock output must be tuned with a series resistor to dampen reflections, and the bus should be terminated at the far end with a parallel resistor network only if multiple devices share the bus.
Do not assume all MPC860 variants share the exact same peripheral pinout despite the common 357-PBGA package. The MPC855T and MPC857T variants have different CPM configurations, so verify each ball map against your schematic before substituting. The NRND status means firmware developers must plan migration paths to PowerQUICC II (MPC8275) or PowerQUICC III (MPC8560) for new product introductions.
合規資訊
RoHS compliant and lead free per NXP product page and distributor listings. Not AEC-Q100 qualified - this is a commercial-grade MPU intended for telecom and networking equipment, not automotive. Halogen-free status not explicitly stated in verified data.
