MPX5700GP1117 vs MPX5700DP 比較

詳細並排比較 MPX5700GP1117 由 NXP Semiconductors 與 MPX5700DP 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
MPX5700GP1117 MPX5700GP1117 - 700 kPa Integrated Pressure Sensor | NXP

MPX5700GP1117 - 700 kPa Integrated Pressure Sensor | NXP

MPX5700GP1117 ✓ 啟用中
NXP Semiconductors
MPX5700DP MPX5700DP - 700 kPa Differential Pressure Sensor, 6-SIP | NXP

MPX5700DP - 700 kPa Differential Pressure Sensor, 6-SIP | NXP

MPX5700DP ✓ 啟用中

規格比較

參數 MPX5700GP1117 MPX5700DP
品牌 NXP Semiconductors NXP Semiconductors
類別 Pressure Sensors Pressure Sensors
生命週期狀態 啟用中 啟用中
Pressure Type Vented Gauge Differential
Operating Pressure Range 0 kPa to 700 kPa (0 to 101.53 PSI) 0 kPa to 700 kPa (0 psi to 101.5 psi)
Maximum Overload Pressure 2100 kPa [DATA_NEEDED: maximum overload pressure]
供應電壓 4.75 V to 5.25 V (5 V typical) 4.75 V to 5.25 V (5 V typical)
供應電流 10 mA typical [DATA_NEEDED: supply current]
輸出類型 Analog voltage, ratiometric Analog voltage, ratiometric
輸出電壓範圍 0.2 V to 4.7 V (at 5 V supply) 0.2 V to 4.7 V
Accuracy ±2.5% (0°C to 85°C) ±2.5% VFSS (0°C to 85°C)
Response Time 1 ms typical 1 ms (typical)
工作溫度 -40°C to +125°C -40°C to +125°C
Compensated Temperature 0°C to 85°C —
Port Style GP - vertical port with 4.93 mm (0.19 in) tube Dual Male 0.19" (4.93 mm) Tube, Horizontal
封裝 6-SIP through-hole module —
安裝類型 Through-Hole (vertical port) Through-hole, vertical SIP
Signal Conditioning On-chip amplified, temperature compensated —
Calibration On-chip laser-trimmed —
RoHS 狀態 Compliant [DATA_NEEDED: RoHS status]
Full-Scale Span (VFSS) — 4.5 V (typical)
封裝 / 外殼 — 6-SIP Module (Case 867C-05)
Technology — Piezoresistive MEMS, bipolar signal conditioning

資料表與資源

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