MT29F1G08ABAEAWP-IT:E vs K9F2808UOC-PCB0 比較

詳細並排比較 MT29F1G08ABAEAWP-IT:E 由 Micron Technology 與 K9F2808UOC-PCB0 由 Samsung Electronics. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Micron Technology
MT29F1G08ABAEAWP-IT:E MT29F1G08ABAEAWP-IT:E - 1Gbit SLC NAND Flash | Micron

MT29F1G08ABAEAWP-IT:E - 1Gbit SLC NAND Flash | Micron

MT29F1G08ABAEAWP-IT:E ✓ 啟用中
Samsung Electronics
K9F2808UOC-PCB0 K9F2808UOC-PCB0 - 16M x 8 NAND Flash, 48-TSOP I | Samsung

K9F2808UOC-PCB0 - 16M x 8 NAND Flash, 48-TSOP I | Samsung

K9F2808UOC-PCB0 Nrnd

規格比較

參數 MT29F1G08ABAEAWP-IT:E K9F2808UOC-PCB0
品牌 Micron Technology Samsung Electronics
類別 Memory ICs Memory ICs
生命週期狀態 啟用中 NRND
記憶體容量 1 Gbit (128 MB) —
組織 128M x 8 16M x 8 bit
介面 Parallel —
供應電壓 3.3 V —
Access Time 25 ns —
Page Size 2048 bytes + 64 bytes spare 528 bytes (512 main + 16 spare)
Block Size 128 KB 16 pages (16 KiB + 256 spare bytes)
Program Time 200 us (typical) —
Erase Time 2 ms (typical) —
Endurance 100K program/erase cycles —
Data Retention 10 years —
工作溫度 -40C to +85C Commercial / Industrial (C, I grade)
封裝 TSOP-48 —
安裝類型 Surface Mount —
RoHS 狀態 Compliant —
記憶體類型 — NAND Flash (SLC, Small-Page)
Memory Density — 128 Mbit (16M x 8)
Operating Voltage (VCC) — 2.7 V to 3.6 V
Read Access Time — 50 ns
Package Options — 48-TSOP I, 48-WSOP1, 63-TBGA
I/O Bus Width — x8
Command Set — Standard NAND (00h/01h/10h/30h/60h/D0h/50h)
Status Output — R/B# open-drain ready/busy
Technology Node — Samsung 2nd-generation SLC NAND
Cell Type — Single-Level Cell (SLC)
Programming Model — Page program, block erase
Lead-Free / RoHS — [DATA_NEEDED: RoHS status from Samsung datasheet]

資料表與資源

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