OSD3358-512M-BAS-XB vs OSD3358-512M-ISM 比較
詳細並排比較 OSD3358-512M-BAS-XB 由 Octavo Systems 與 OSD3358-512M-ISM 由 Octavo Systems. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Octavo Systems
OSD3358-512M-BAS-XB - SiP ARM Cortex-A8 1GHz | Octavo Systems
OSD3358-512M-BAS-XB ✓ 啟用中Octavo Systems
OSD3358-512M-ISM - 1GHz Cortex-A8 SiP SOM, 512MB DDR3 | Octavo Systems
OSD3358-512M-ISM ✓ 啟用中規格比較
| 參數 | OSD3358-512M-BAS-XB | OSD3358-512M-ISM |
|---|---|---|
| 品牌 | Octavo Systems | Octavo Systems |
| 類別 | Microcontrollers | Wireless Modules |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Device Type | System-In-Package (SiP) | — |
| Integrated Processor | TI Sitara AM3358 ARM Cortex-A8 | — |
| Maximum CPU Clock | 1 GHz | — |
| Graphics Accelerator | SGX530 | — |
| Onboard DDR3 SDRAM | 512 MB | — |
| Power Management IC | TPS65217C (integrated) | — |
| 工作溫度範圍 | -40 C to +85 C (industrial) | — |
| 封裝 | 400-ball BGA | 256-ball BGA, 21 mm x 21 mm |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| PRU-ICSS Subsystems | 2 (industrial-grade) | — |
| Ethernet | 10/100/1000 Mbps (Gigabit) | — |
| USB | USB 2.0 High-Speed PHY | — |
| CAN | 2x CAN 2.0B | — |
| SPI | 2x SPI | — |
| I2C | 3x I2C | — |
| RoHS 狀態 | Compliant | Compliant |
| Product Type | — | System-in-Package (SiP) / System-on-Module (SOM) |
| Series | — | OSD3358 |
| Core Processor | — | Texas Instruments AM3358 ARM Cortex-A8 NEON SIMD |
| CPU Speed | — | 1 GHz |
| RAM Size | — | 512 MB DDR3 |
| PMIC | — | TPS65217C |
| Auxiliary LDO | — | TL5209 |
| EEPROM | — | 4 KB |
| Form Factor | — | SiP (System-in-Package) |
| Ball Pitch | — | [DATA_NEEDED: ball pitch] |
| 工作溫度 | — | -40C to +85C (industrial) |
| 供應電壓 | — | [DATA_NEEDED: main rail voltage] |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Tray Quantity | — | [DATA_NEEDED: tray qty] |