P1011NSE2DFB vs P1011NXE2DFB 比較

詳細並排比較 P1011NSE2DFB 由 NXP Semiconductors 與 P1011NXE2DFB 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
P1011NSE2DFB P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB - QorIQ P1 800MHz PowerPC MPU | NXP Semiconductors

P1011NSE2DFB ✗ 停產
NXP Semiconductors
P1011NXE2DFB P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II

P1011NXE2DFB ✗ 停產

規格比較

參數 P1011NSE2DFB P1011NXE2DFB
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 停產終止 停產終止
Manufacturer NXP Semiconductors —
Series QorIQ P1 —
Processor Type PowerPC e500v2 QorIQ P1 Communications Processor
Core Count 1 —
資料匯流排寬度 32-Bit —
Core Speed 800 MHz —
Core Speed (base) 533 MHz (533/333/667 code) —
Memory Controller DDR2/DDR3 with ECC —
Ethernet 3x Gigabit Ethernet MACs 4x GbE MACs (SGMII/RGMII)
PCIe Yes (PCI Express) —
USB USB 2.0 2x USB 2.0 (host + device)
TDM Yes —
Security Engine (SEC) Yes —
L1 Cache 32 KB instruction + 32 KB data —
L2 Cache 256 KB [DATA_NEEDED: L2 cache size]
封裝 / 外殼 689-TEPBGA II (31x31 mm) with exposed pad —
Packaging Tray —
工作溫度 0 C to 125 C —
Lead Free Status Lead Free —
RoHS 狀態 RoHS Compliant Compliant
Core Architecture — Power Architecture e500, 32-bit
Maximum Core Frequency — 533 MHz
Platform Frequency — 333 MHz
Number of Cores — 1 (single-core)
封裝 — 689-TEPBGA II (31x31 mm) with exposed pad
Ball Pitch — 1.0 mm
工作接面溫度 — -40C to +125C
DDR Memory Controller — 64-bit DDR2/DDR3 with ECC, up to 4 GB
PCI Express — 2x PCIe Gen 1.1 controllers
Security Engine — SEC 4.0 (IPSec/SSL/TLS acceleration)
TDM Interface — Yes (T1/E1)
Silicon Revision — 1.1
Process Technology — 45 nm CMOS
Lead-Free — Yes
MSL 等級 — [DATA_NEEDED: MSL rating]

資料表與資源

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