RTAX1000SL-1CGS624B vs RTAX1000SL-1CGS624V 比較

詳細並排比較 RTAX1000SL-1CGS624B 由 Microchip Technology 與 RTAX1000SL-1CGS624V 由 Microchip Technology. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Microchip Technology
RTAX1000SL-1CGS624B RTAX1000SL-1CGS624B - Rad-Tolerant FPGA 1M Gates | Microchip

RTAX1000SL-1CGS624B - Rad-Tolerant FPGA 1M Gates | Microchip

RTAX1000SL-1CGS624B ✓ 啟用中
Microchip Technology
RTAX1000SL-1CGS624V RTAX1000SL-1CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-1CGS624V - 1M-Gate Rad-Tolerant FPGA | Microchip

RTAX1000SL-1CGS624V ✓ 啟用中

規格比較

參數 RTAX1000SL-1CGS624B RTAX1000SL-1CGS624V
品牌 Microchip Technology Microchip Technology
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Logic Density 1,000,000 equivalent system gates —
ASIC Gates 125,000 additional ASIC gates —
Configurable Logic Blocks (CLBs) 12096 —
Family RTAX-S/SL Radiation-Tolerant FPGA —
Series RTAX1000SL —
Speed Grade -1 -1 (standard)
Technology Digital CMOS —
Programming Technology Anti-fuse (one-time programmable, live at power-up) —
Embedded Memory Embedded SRAM with built-in FIFO control logic Embedded SRAM with built-in FIFO control logic
封裝 624-ball Ceramic CGA (CGS624) —
安裝類型 Surface Mount Surface Mount
Radiation Tolerance Radiation-tolerant (space flight qualified) Radiation-tolerant (space-flight qualified family)
Qualification DLA SMD 5962-0422006QUA per MIL-PRF-38535 —
工作溫度 [DATA_NEEDED: operating temperature range] -55C to +125C
供應電壓 [DATA_NEEDED: core/IO supply voltage] [DATA_NEEDED: core/IO supply voltage]
Maximum User I/O [DATA_NEEDED: maximum user I/O count] —
RoHS 狀態 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Architecture Base Derived from Microsemi commercial Axcelerator family —
System Gates — 1,000,000 (1.00E6)
Logic Cells / Logic Blocks — 12096
Logic Family — Digital CMOS
Programmable Technology — Antifuse (one-time programmable)
Package Type — CGA-624 (ceramic column grid array)
腳位數 — 624
SEU Immunity — SEU-hardened registers; SEU rate < 10-10 errors/bit-day
Configuration — Live at power-up, single chip, no external boot PROM
Clocking — Segmentable clock resources
Routing Features — Chip-wide highway routing, carry logic

資料表與資源

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