S9S08AW60E5MFGE vs MC9S08AC60CFUE 比較

詳細並排比較 S9S08AW60E5MFGE 由 NXP Semiconductors 與 MC9S08AC60CFUE 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

NXP Semiconductors
S9S08AW60E5MFGE S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)

S9S08AW60E5MFGE ✓ 啟用中

規格比較

參數 S9S08AW60E5MFGE MC9S08AC60CFUE
品牌 NXP Semiconductors NXP Semiconductors
類別 Microcontrollers Microcontrollers
生命週期狀態 啟用中 NRND
Core Architecture HCS08 (S08 enhanced), 8-bit CISC —
CPU Clock (Max) 40 MHz (20 MHz bus) —
Program Flash 60 KB (60K x 8) —
RAM [DATA_NEEDED: RAM size] 2 KB
EEPROM / Data Flash [DATA_NEEDED: data EEPROM size] —
供應電壓 3 V / 3.3 V / 5 V 2.7 V to 5.5 V
封裝 44-pin LQFP (10 x 10 mm) 64-QFP (14x14 mm)
I/O Pins [DATA_NEEDED: GPIO count] 54
ADC Multi-channel 10-bit (per family) 10-bit, up to 16 channels
Communication SCI (UART), SPI, I2C —
Timers TPM modules with PWM channels Multiple PWM-capable channels
Debug Interface BDM (Background Debug Mode) —
工作溫度 -40C to +125C (automotive range) -40C to +85C / +105C (automotive)
安裝類型 Surface Mount Surface Mount
Family S08 / MC9S08AW60 series —
Automotive/Industrial Dual-targeted —
Lead Free / RoHS Yes (per suffix "E" = Pb-free, "R" = tape & reel) —
Core — HCS08 (8-bit)
CPU Frequency — 40 MHz (20 MHz internal bus)
Flash Memory — 60 KB
SCI Modules — 2 (LIN 2.0 / SAE J2602)
SPI Modules — 1
IIC Modules — 1
RoHS — Compliant
Lifecycle — NRND (Not Recommended for New Designs)

資料表與資源

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