W25X40CLZPIG vs W25X40CLZPIG-TR 比較
詳細並排比較 W25X40CLZPIG 由 Winbond 與 W25X40CLZPIG-TR 由 Winbond. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | W25X40CLZPIG | W25X40CLZPIG-TR |
|---|---|---|
| 品牌 | Winbond | Winbond |
| 類別 | Memory ICs | Memory ICs |
| 生命週期狀態 | 啟用中 | 啟用中 |
| 記憶體類型 | NOR Flash | Non-Volatile NOR Flash |
| 記憶體容量 | 4 Mbit (512K x 8) | 4 Mbit (512 Kbit x 8) |
| 介面 | SPI, Dual-SPI, Quad-SPI | — |
| 最大時脈頻率 | 104 MHz | — |
| Sector Size | 4 KB uniform | 4 KB (uniform sector) |
| Page Size | 256 bytes | — |
| Access Time | 8 ns | 8 ns |
| 供應電壓 | 2.5 V to 3.3 V | — |
| 封裝 | 8-WSON (6x5 mm) with exposed pad | 8-WSON (6 x 5 mm) with Exposed Pad |
| 腳位數 | 8 | — |
| 工作溫度 | -40C to +85C | -40C to +85C |
| Sector Erase Time | 40 ms typical | — |
| Page Program Time | 1.4 ms typical | — |
| Write Protection | Hardware /WP pin + software STATUS register | Hardware (/WP pin) and Software (status register) |
| RoHS 狀態 | Compliant | Compliant (per Winbond product page) |
| 安裝類型 | Surface Mount | Surface Mount |
| JEDEC ID Read | Yes (0xEF3013 manufacturer/device) | — |
| Memory Organization | — | 512K x 8 |
| Memory Interface | — | SPI (Standard and Dual SPI) |
| Maximum SPI Clock Frequency | — | 104 MHz |
| Operating Voltage | — | 2.5 V / 3.3 V |
| Block Erase Sizes | — | 32 KB and 64 KB |
| Page Program Size | — | Up to 256 bytes per command |
| Package Designator | — | ZP |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |