10AS048K4F35I3LG - Arria 10 SX 480K SoC FPGA | Intel | BGA-1152
MPN： 10AS048K4F35I3LG ✓ 啟用中10AS048K4F35I3LG 概覽
A SoC FPGA combines a hard processor system (CPU, memory controllers, peripherals) with an FPGA fabric on a single die, allowing deterministic hardware acceleration alongside software programmability. Within the broader taxonomy, this places 10AS048K4F35I3LG in: SoC FPGA -> FPGA -> programmable logic device -> digital IC -> semiconductor. The Arria 10 SX family targets mid-range applications balancing performance, power, and cost between Cyclone V/10 (low-power) and Stratix 10 (high-end).
Key features include 480K logic elements (LEs), 1.5 GHz dual-core ARM Cortex-A9 MPCore with NEON media engine, integrated CoreSight debug and trace, 28.05 Mbits embedded block RAM, 1568 18x19 multipliers, 8 transceiver channels supporting up to 6.144 Gbps data rates, and 4 PLLs with fractional synthesis. The -I temperature grade specifies an industrial operating range of -40C to +100C junction, suitable for harsh-environment deployment.
The architecture pairs a hard quad-core ARM Cortex-A9 MPCore (dual-core active in this variant) with a coherent interconnect to the FPGA fabric, enabling hardware accelerators to share DDR memory with software tasks. The 20nm process node provides a balanced trade-off between static power, dynamic performance, and transceiver density, while dedicated DSP blocks deliver up to 1.5 TFLOPs of fixed/floating-point throughput for radar, video, and wireless baseband workloads.
Typical applications include industrial machine vision over GigE Vision, 5G small-cell baseband pre-processing, motor and motion control with sub-microsecond deterministic response, test and measurement equipment requiring custom I/O timing, medical imaging pre-processing (ultrasound beamforming), and aerospace flight control prototyping. The dual HPS enables Linux + RTOS asymmetric multiprocessing for safety-critical partitioning.
When designing with this device, pay close attention to the high pin count (1152 balls) and BGA escape routing - 12-layer PCB with microvia stacks is recommended. Use Quartus Prime Pro toolchain for synthesis and place-and-route; pre-built DDR3/DDR4 controller IP from Intel accelerates memory integration. Plan thermal management around 31 W typical TDP using a heatsink with 1 C/W or better.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Site MPN list, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a faster path from MPN to production board.
直接替換替代品，適用於 10AS048K4F35I3LG — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： 10AS048K4F35I3LG （相同外形與佔位） — 差異在於 Package, Mounting Type, Operating Temperature, Logic Elements, Family.
10AS048K3F35I2LG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K3F35E3LG
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10AS048K3F35I2SG
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✅ 直接替換聯絡詢價
查看資料表 →10AS048K4F35E3SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048K4F35I3SG
✅ 直接替換聯絡詢價
查看資料表 →10AS048H4F34I3LG
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查看資料表 →10AS048K4F35I3LG 最大額定值與電氣特性
| Series | Arria 10 SX |
| Family | Arria 10 SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Frequency | Up to 1.5 GHz |
| Embedded Block RAM | 28.05 Mbits |
| DSP Blocks (18x19 Multipliers) | 1568 |
| Transceiver Channels | 8 (up to 6.144 Gbps) |
| PLLs | 4 fractional |
| 封裝 | 1152-ball FCBGA (35x35 mm) |
| Process Node | TSMC 20nm |
| Operating Temperature Grade | Industrial (-40C to +100C junction) |
| 安裝類型 | Surface Mount (BGA) |
| MSL 等級 | 3 (per JEDEC J-STD-020) |
| RoHS 狀態 | Compliant |
| Lead-Free | Yes |
| Supply Voltage Core | 0.9 V (core), 1.8 V / 2.5 V / 3.3 V (I/O) |
10AS048K4F35I3LG 1152-ball fcbga (35x35 mm) 腳位配置指南
10AS048K4F35I3LG（1152-ball fcbga (35x35 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： 10AS048K4F35I3LG.
請參閱 資料表 以查看完整腳位配置。
典型應用
10AS048K4F35I3LG 適用於 6 應用s: 5G Small-Cell Baseband Pre-Processing, Industrial Machine Vision Processing, Motor and Motion Control, Test and Measurement Instrumentation, Medical Ultrasound Beamforming, Aerospace Flight Control Prototyping.
5G Small-Cell Baseband Pre-Processing
The 10AS048K4F35I3LG fits 5G small-cell baseband pre-processing because its 480K logic elements plus 1568 DSP blocks deliver up to 1.5 TFLOPs of compute, sufficient to handle PHY-layer FFT/iFFT, channel estimation, and digital pre-distortion at CPRI line rates. Its 8 embedded transceivers support 6.144 Gbps CPRI, which maps cleanly to 4G/5G fronthaul aggregation. The hard dual-core ARM Cortex-A9 HPS running Linux offloads non-realtime MAC/scheduling tasks, while the FPGA fabric handles deterministic DSP with sub-microsecond latency. Place the device between the radio unit (RU) and baseband unit (BBU); DDR3 controller IP manages the symbol buffer.
推薦
Industrial Machine Vision Processing
The 10AS048K4F35I3LG is well matched to industrial machine vision because its high logic density and 28 Mbits block RAM allow multiple image pipelines to run concurrently - Bayer demosaic, lens correction, defect detection, and CoaXPress decoding. The dual-core ARM Cortex-A9 MPCore HPS runs the host-side GigE Vision or GenICam stack on Linux while the FPGA fabric performs deterministic pixel processing. Industrial -I temperature grade (-40C to +100C junction) supports factory-floor deployments without thermal derating. The 1152-ball FCBGA footprint integrates cleanly with multi-camera CoaXPress-12 frame grabbers.
推薦
Motor and Motion Control
The 10AS048K4F35I3LG targets precision motor and motion control where its 1568 18x19 DSP blocks implement field-oriented control (FOC) and space-vector PWM at switching frequencies up to 200 kHz. The dual ARM Cortex-A9 MPCore handles trajectory planning and EtherCAT/CANopen master stacks while the FPGA fabric runs deterministic current/torque loops with sub-microsecond response. Industrial temperature grade supports servo-drive cabinet environments. Hardware parallelism allows multi-axis control from a single chip - 4-6 servo axes are typical. Pair with external Sigma-Delta ADCs for current sensing.
推薦
Test and Measurement Instrumentation
The 10AS048K4F35I3LG suits high-end test and measurement because its 8 transceivers at 6.144 Gbps aggregate multi-channel ADC/DAC data (e.g., 4x 12-bit 1 GSPS ADCs via JESD204B), while 480K LEs implement custom trigger logic and protocol decoding. The hard Cortex-A9 HPS runs Linux hosting SCPI command parsing and USB/LXI connectivity; the FPGA fabric handles deterministic waveform generation and acquisition. The industrial -I temperature grade and 1152-ball FCBGA fit standard oscilloscope/AWG form factors. Block RAM (28 Mbits) buffers long captures before transfer to host.
推薦
Medical Ultrasound Beamforming
The 10AS048K4F35I3LG supports medical ultrasound beamforming where 1568 18x19 multipliers perform apodization, delay-and-sum, and Hilbert transform across 64-128 channels in real time. The 28 Mbits block RAM store sample histories for dynamic focusing, while the dual ARM Cortex-A9 HPS manages the user interface, image post-processing, and DICOM stack. Industrial temperature grade is acceptable for clinical settings; the FCBGA-1152 footprint fits standard cart-mounted ultrasound boards. Power budget (~31 W typical) requires careful heatsinking but remains air-cooled.
推薦
Aerospace Flight Control Prototyping
The 10AS048K4F35I3LG enables aerospace flight control prototyping where deterministic sub-microsecond response is mandatory for actuator control loops. The dual ARM Cortex-A9 HPS can run a safety partition (RTOS + DO-178C code) while the FPGA fabric executes hardware-implemented control laws with deterministic latency. Industrial temperature grade supports avionics bay environments; designers should review the package reliability profile for vibration per DO-160. The high 480K logic density accommodates multiple redundant control channels. Transceivers enable MIL-STD-1553B or ARINC 429 bridging.
推薦
推薦產品摘要
工程參考資料，適用於 10AS048K4F35I3LG — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | 10AS048K3F35I2LG | 10AS048K3F35E3LG | 10AS048K4F35E3LG | 10AS048K4F35I3SG |
|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35 mm) | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same | 1152-FCBGA (35x35 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Speed Grade | 4 (highest) | 3 (~15% lower Fmax) | 3 (~15% lower Fmax) | 4 (same as this product) | 4 (same as this product) |
| Temperature Grade | Industrial (-40C to +100C junction) | Industrial | Enhanced | Enhanced | Industrial |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| DSP Blocks (18x19) | 1568 | 1568 | 1568 | 1568 | 1568 |
| Embedded Block RAM | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits | 28.05 Mbits |
| Transceiver Channels | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) | 8 (up to 6.144 Gbps) |
主要差異化特點
- Highest speed grade (4) in the Arria 10 SX 480K family (對比10AS048K3F35I2LG)
- Industrial temperature grade (-40C to +100C junction) (對比10AS048K4F35E3LG)
- Dual ARM Cortex-A9 HPS integration eliminates external processor (對比10AS048K3F35E3LG)
- 8 transceivers supporting up to 6.144 Gbps for CPRI/JESD (對比10AS048K3F35I2SG)
設計說明
The 1152-ball FCBGA at 1.0 mm pitch requires a minimum 12-layer PCB with stacked-microvia (laser-drilled + plated) technology in the BGA escape region. Use 0.5 oz copper on outer layers and 1 oz on inner power planes. Keep-out zones under the BGA must be clear of through-hole components to maintain clearance for the rework profile. Decouple each VCCINT/VCCA/VCCD bank with 100nF X7R capacitors plus 10uF bulk ceramics within 5mm of the ball. Refer to Intel AN 583: 'Design Guidelines for Arria 10 FPGAs' for full escape routing recommendations.
Estimated: at typical utilization (50% LEs, 80% DSP, 1.5 GHz HPS active), the device dissipates approximately 31 W TDP. With theta_JA around 8 C/W (FCBGA, 4-layer PCB, 200 LFM airflow), junction temperature rises ~25 C above inlet - acceptable within the 100 C industrial ceiling but requires a heatsink with thermal interface material. For 0 LFM (sealed enclosure), derate to 70% utilization or use a 1 C/W heatsink with conduction cooling. Junction temperature must be monitored via the on-die temperature sensor accessible through the SDM mailbox.
Place transceiver reference-clock sources (e.g., Si5341) within 100mm trace length and route as 100-ohm differential stripline on inner layers with continuous ground reference. Place HPS reference clock and reset logic within 25mm. Multi-gigabit serial links require AC-coupling capacitors on each transmit lane; consult the Arria 10 GX/SX Transceiver User Guide section 3 for lane placement rules. Power-rail sequencing (VCCINT before VCCA before VCCIO) must follow the Intel-supplied power-management IC (e.g., LTC2923) sequence or risk latch-up.
Do not substitute 10AS048K4F35I3LG with a 10AS066K4F35I3LG (660K LEs) without re-running place-and-route - bitstream is not compatible. Also do not substitute between F35 (35x35 mm) and F34 (34x34 mm) packages - ball map differs. When using configuration via JTAG, ensure VCCPD is stable before JTAG TCK toggles, or the device may enter a non-recoverable state requiring power cycling. Always load the latest device firmware (FSBL) before bringing HPS out of reset.
合規資訊
RoHS and REACH compliant per Intel/Altera product compliance declaration. Halogen-free per JEDEC JS709B. Not AEC-Q100 qualified (industrial grade, not automotive).
