10AS048K4F35E3LG - Arria 10 SX SoC FPGA, 480K LE, 1152-FBGA | Intel
MPN: 10AS048K4F35E3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4620 | $46,200.00 |
| 100 | $4390 | $439,000.00 |
| 500 | $4185 | $2,092,500.00 |
| 1,000 | $3975 | $3,975,000.00 |
10AS048K4F35E3LG Overview
An SoC FPGA is a class of programmable logic device that integrates a hard processor subsystem with the FPGA fabric on a single die, blurring the boundary between ASIC, ASSP, and traditional microcontroller + FPGA multi-chip solutions. The Arria 10 SX sits in the mid-range of Intel's programmable portfolio, offering higher DSP throughput and transceiver count than Cyclone V/10 devices, but lower static power and higher logic density than Stratix V. Within the system hierarchy, it falls under programmable logic -> FPGA -> SoC FPGA -> embedded processor platform.
Key features of the 10AS048K4F35E3LG include dual ARM Cortex-A9 cores with CoreSight for trace and debug, integrated DDR3/DDR4/LPDDR3 memory controllers in the HPS, on-chip transceivers capable of multi-gigabit serial links, hard PCIe Gen2/Gen3 IP blocks, and a variable-precision DSP block architecture that lets the fabric run fixed- or floating-point operations efficiently. The package integrates 1152 balls on a 1 mm pitch for high I/O count with managed signal integrity.
On the architectural side, the 20 nm SoC die couples the HPS block and FPGA fabric through coherent AXI/ACP bridges, enabling shared L2 cache coherency between CPU and fabric accelerators. Hardware memory controllers in the HPS reduce latency versus soft controllers, while hard PCIe and 10 Gbps transceivers eliminate the need for soft IP, freeing logic for application code.
Typical applications include wireless baseband processing, radar and DSP front-end cards, test and measurement equipment, broadcast video processing, industrial machine vision, and military/aerospace signal processing. Engineers select this device when they need deterministic hard-processor latency plus the parallel throughput of an FPGA fabric on a single board.
A key design consideration: the 0.9 V core rail requires tight sequencing relative to the 1.8 V/2.5 V I/O and PLL rails, and the 1152-ball FCBGA demands a multi-layer PCB with microvia stack-ups and matched-length DDR traces. Always validate thermal envelope against the application note's junction-to-ambient figures.
This page synthesizes distributor pricing, drop-in Arria 10 SX family alternatives, and PCB/datasheet-driven design notes not duplicated on the manufacturer product page.
Drop-in alternatives for 10AS048K4F35E3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10AS048K4F35E3LG (same form factor and footprint) — differing in Package, Mounting Type, Logic Elements, Operating Temperature, Product Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K4F35E3SG
✅ Drop-In✓ In Stock
$2890 / Unit
View Datasheet →10AS048K4F35E2LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048K4F35E2SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048K3F35E2LG
✅ Drop-In✓ In Stock
$3495 / Unit
View Datasheet →10AS048K3F35E2SG
✅ Drop-In✓ In Stock
$2720 / Unit
View Datasheet →10AS048K2F35E2LG
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →10AS048K4F35E3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Product Type | SoC FPGA (HPS + FPGA fabric on one die) |
| Logic Elements | 480,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| HPS Maximum Clock | 1.5 GHz |
| Package | 1152-ball FBGA, FC (35 x 35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (per 'I' designator in E3LG suffix) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
10AS048K4F35E3LG 1152-ball fbga, fc (35 x 35 mm) Pin Configuration Guide
Pin configuration for 10AS048K4F35E3LG (1152-ball fbga, fc (35 x 35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K4F35E3LG.
Refer to the datasheet for full pin configuration.
Typical Applications
10AS048K4F35E3LG is suitable for 6 applications: Wireless Baseband and 4G/5G PHY Prototyping, Radar and Electronic-Warfare Signal Processing, Test and Measurement Instrumentation, Broadcast Video Processing and Codec Acceleration, Industrial Machine Vision and Image Processing, Aerospace and Defense Signal Processing.
Wireless Baseband and 4G/5G PHY Prototyping
The 10AS048K4F35E3LG's 480,000 logic elements, variable-precision DSP blocks, and multi-gigabit transceivers deliver the fabric density and serial bandwidth needed for baseband PHY prototyping. With a dual Cortex-A9 HPS running at 1.5 GHz, designers can host the MAC and upper-layer stack on-chip while offloading the PHY pipeline to the FPGA fabric. Placed on a high-layer-count PCB with matched-length DDR4 traces, this device can sustain real-time LTE and sub-6 GHz 5G numerology simulations.
Recommended
Radar and Electronic-Warfare Signal Processing
The Arria 10 SX 10AS048K4F35E3LG supports up to 28 nm-class DSP throughput in a 20 nm process, with on-chip transceivers capable of multi-gigabit IF sampling. The HPS handles housekeeping, beam-steering tables, and Ethernet control while the fabric runs FFT, pulse compression, and CFAR detection in real time. Designers typically pair it with external ADCs and DACs to build a complete phased-array processor card for radar/EW platforms.
Recommended
Test and Measurement Instrumentation
With its 480K logic-element fabric, dual ARM Cortex-A9 HPS, and PCIe Gen2/Gen3 hard IP, the 10AS048K4F35E3LG is well suited to high-end oscilloscopes, protocol analyzers, and arbitrary waveform generators. The HPS runs the host UI and Ethernet/SCPI stack while the fabric executes real-time DSP for trigger logic, decimation, and signal synthesis at gigasample-per-second rates.
Recommended
Broadcast Video Processing and Codec Acceleration
The 10AS048K4F35E3LG's high DSP count and fabric parallelism accelerate HEVC/H.264 encode and decode, color-space conversion, and frame-rate conversion for broadcast and pro-AV workflows. The dual Cortex-A9 HPS runs the Linux media stack and network I/O, offloading codec processing to the FPGA fabric for deterministic latency. PCI Express Gen3 hard IP enables direct attachment to host capture cards.
Recommended
Industrial Machine Vision and Image Processing
The 10AS048K4F35E3LG supports multi-camera image pipelines via its multi-gigabit transceivers (MIPI CSI-2, GigE Vision, CoaXPress via soft IP) and provides the fabric throughput for real-time defect detection, OCR, and 3D vision. The Cortex-A9 HPS runs the Linux vision stack, while the fabric accelerates convolutional filters and pre-processing. Operating at 0.9 V core and the industrial temperature grade, it fits factory-floor enclosures.
Recommended
Aerospace and Defense Signal Processing
The 10AS048K4F35E3LG's combination of high logic density, hard ARM Cortex-A9 HPS, and on-chip transceivers makes it a candidate for avionics datalink processing, electronic warfare, and software-defined radio payloads. The 1152-ball FCBGA provides the I/O count needed for multi-channel RF interfaces, while the 20 nm process delivers the performance-per-watt profile demanded by SWaP-constrained platforms.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K4F35E3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K4F35E3SG | 10AS048K4F35E2LG | 10AS048K4F35E2SG | 10AS048K3F35E2LG | 10AS048K3F35E2SG | 10AS048K2F35E2LG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Core | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | -4 (fastest) | -4 | -2 | -2 | -3 | -3 | -2 |
| Transceiver Tier | K4 (highest) | K4 | K4 | K4 | K3 | K3 | K2 |
| Packing Medium | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tray |
| Approximate Unit Price (USD, as of 2026-09-05) | 4850.00 | 4850.00 | 3950.00 | 3950.00 | 4350.00 | 4350.00 | 3450.00 |
Key Differentiators
- Highest speed grade (-4) in the F35-package Arria 10 SX 480K family (vs 10AS048K3F35E2LG)
- Tray packing for low-volume prototyping (vs 10AS048K4F35E3SG)
- Full K4 transceiver count for maximum serial bandwidth (vs 10AS048K2F35E2LG)
Design Notes
The 1152-ball FCBGA at 35 mm x 35 mm demands a high-layer-count PCB (typically 12+ layers) with stacked microvias on the BGA break-out. Reference Intel's Arria 10 PCB design guidelines for via-in-pad and decoupled power-plane geometry. Estimated: keep BGA fan-out escape within the package outline to avoid via stubs on high-speed transceiver channels, and place at least 4 stitching vias around each power island to suppress ground bounce.
The 10AS048K4F35E3LG requires multi-rail sequencing between the 0.9 V core, 1.8 V/2.5 V I/O, and PLL supplies per the Arria 10 family datasheet power-up sequence. Use the dedicated SmartVID controller interface to negotiate voltage with the regulator; do not back-power any rail. Estimated: at full fabric utilization, the 0.9 V core can draw 15-25 A, so use a multiphase buck regulator with output inductor below 0.5 microhenry.
The 1152-ball FCBGA's thermal envelope must be characterized per the Arria 10 thermal management application note. Estimated: at full 480K-LE utilization with sustained DSP activity, junction temperature can approach 95-100 C without a heatsink; attach a 25x25 mm heat spreader with thermal interface material rated for the industrial temperature grade. Forced-air cooling at 200 LFM is recommended for chassis-mounted designs.
Do not assume all F35-package 10AS048K variants are pin-compatible across different speed grades - some K2 vs K4 variants allocate transceivers to different ball positions. Always re-run the Intel Quartus Prime pin planner when substituting K4 with K2 or K3 SKUs. Also note that the E3LG/E2LG suffix changes operating temperature grade, not electrical ball-out.
Compliance Information
RoHS compliance confirmed on the Intel/Altera ordering part number page; AEC-Q100 not applicable to FPGAs. Halogen-free status not explicitly published in the provided data and is marked unknown.
